Inventor · disambiguated record
Wen-Bo Ding
Also filed as: DING WEN · Ding Wen-Bo
3 granted patents·3 pending applications·23 citations·filing 2007–2018
62Inventor score
Files withUNITED MICROELECTRONICS CORP3MICROSOFT TECHNOLOGY LICENSING LLC2SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
6 records- 0192US10580823B2Wafer level packaging methodUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 3, 2020·21 cites·19 claims
- 0272US9852912B1Method of manufacturing semiconductor device for reducing grain size of polysiliconUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 26, 2017·2 cites·17 claims
- 0344US10622253B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·15 claims
- 0437US2007188920A1Microinductor and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0533US2017076318A1Enhanced content quality using content featuresMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2015·Application pending·0 cites
- 0631US2017228462A1Adaptive seeded user labeling for identifying targeted contentMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →