Inventor · disambiguated record
Wei-Ming Hsiao
Also filed as: HSIAO WEI-MING
10 granted patents·1 pending application·19 citations·filing 2015–2023
81Inventor score
Top patents by PatentIndex Score
11 records- 0195US9659937B2Semiconductor process of forming metal gates with different threshold voltages and semiconductor structure thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 23, 2017·14 cites·20 claims
- 0288US10074725B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 11, 2018·5 cites·17 claims
- 0366US11424408B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 23, 2022·0 cites·7 claims
- 0461US12274087B2Field effect transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 0561US12211888B2Method for forming a thin film resistor with improved thermal stabilityUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 0657US11165019B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 2, 2021·0 cites·9 claims
- 0757US10340350B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·0 cites·2 claims
- 0856US11139384B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·8 claims
- 0952US2025031389A1Capacitor device and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
- 1047US10490643B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 26, 2019·0 cites·10 claims
- 1143US9691704B1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 27, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →