Inventor · disambiguated record
Wen-Lo Hsieh
Also filed as: HSIEH WEN-LO
5 granted patents·1 pending application·10 citations·filing 1997–2024
69Inventor score
Top patents by PatentIndex Score
6 records- 0160US12420541B2Mold and gas sensor sealing method using moldHSIEH WEN LO·Filed 2023·Granted Sep 23, 2025·0 cites·6 claims
- 0254US2025290886A1Gas sensor package structureHSIEH WEN LO·Filed 2024·Application pending·0 cites
- 0350US7076870B2Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blankPERICOM SEMICONDUCTOR CORP·Filed 2004·Granted Jul 18, 2006·7 cites·18 claims
- 0426US6521484B1Mold injection method for semiconductor deviceORIENT SEMICONDUCTOR ELECT LTD·Filed 1999·Granted Feb 18, 2003·2 cites·2 claims
- 0524US6033934ASemiconductor chip fabrication method and apparatus thereforORIENT SEMICONDUCTOR ELECT LTD·Filed 1997·Granted Mar 7, 2000·1 cites·2 claims
- 0624US5821607AFrame for manufacturing encapsulated semiconductor devicesORIENT SEMICONDUCTOR ELECT LTD·Filed 1997·Granted Oct 13, 1998·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Wen-Lo Hsieh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →