Inventor · disambiguated record
Wen-Sung Hsu
Also filed as: HSU WEN-SUNG
65 granted patents·20 pending applications·190 citations·filing 2004–2025
98Inventor score
Top patents by PatentIndex Score
85 records- 0196US12136597B2Semiconductor package having an interposer in which one or more dies are formed and method of forming the sameMEDIATEK INC·Filed 2021·Granted Nov 5, 2024·4 cites·31 claims
- 0296US9597752B2Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2015·Granted Mar 21, 2017·7 cites·20 claims
- 0395US11854930B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·2 cites·18 claims
- 0493US11742564B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2021·Granted Aug 29, 2023·2 cites·5 claims
- 0593US11574881B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2021·Granted Feb 7, 2023·2 cites·13 claims
- 0693US10236187B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2018·Granted Mar 19, 2019·3 cites·20 claims
- 0793US9908203B2Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2017·Granted Mar 6, 2018·4 cites·18 claims
- 0893US9761534B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Sep 12, 2017·11 cites·19 claims
- 0991US11469152B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 1091US11081453B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2019·Granted Aug 3, 2021·6 cites·16 claims
- 1191US10573579B2Semiconductor package with improved heat dissipationMEDIATEK INC·Filed 2018·Granted Feb 25, 2020·10 cites·17 claims
- 1291US10109608B2Semiconductor packageMEDIATEK INC·Filed 2016·Granted Oct 23, 2018·7 cites·19 claims
- 1390US11373957B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2020·Granted Jun 28, 2022·2 cites·12 claims
- 1490US10553526B2Semiconductor packageMEDIATEK INC·Filed 2017·Granted Feb 4, 2020·5 cites·21 claims
- 1589US11043730B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2019·Granted Jun 22, 2021·5 cites·19 claims
- 1688US11652273B2Innovative air gap for antenna fan out packageMEDIATEK INC·Filed 2022·Granted May 16, 2023·1 cites·17 claims
- 1788US10573616B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2016·Granted Feb 25, 2020·4 cites·26 claims
- 1888US9922844B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Mar 20, 2018·5 cites·12 claims
- 1987US11024954B2Semiconductor package with antenna and fabrication method thereofMEDIATEK INC·Filed 2019·Granted Jun 1, 2021·5 cites·25 claims
- 2087US9177899B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2012·Granted Nov 3, 2015·9 cites·8 claims
- 2186US10217716B2Semiconductor package and method for fabricating the sameMEDIATEK INC·Filed 2017·Granted Feb 26, 2019·8 cites·6 claims
- 2286US9000581B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Apr 7, 2015·7 cites·19 claims
- 2385US10573536B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2019·Granted Feb 25, 2020·2 cites·20 claims
- 2485US8952552B2Semiconductor package assembly systems and methods using DAM and trench structuresZANG RUEY KAE·Filed 2009·Granted Feb 10, 2015·20 cites·12 claims
- 2584US11450606B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2019·Granted Sep 20, 2022·3 cites·11 claims
- 2684US10756040B2Semiconductor package with rigid under bump metallurgy (UBM) stackMEDIATEK INC·Filed 2018·Granted Aug 25, 2020·4 cites·19 claims
- 2781US10991669B2Semiconductor package using flip-chip technologyMEDIATEK INC·Filed 2016·Granted Apr 27, 2021·3 cites·23 claims
- 2881US10115604B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2015·Granted Oct 30, 2018·2 cites·22 claims
- 2980US10784206B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·2 cites·17 claims
- 3079US9553040B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Jan 24, 2017·3 cites·26 claims
- 3179US9520349B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Dec 13, 2016·2 cites·20 claims
- 3278US10515887B2Fan-out package structure having stacked carrier substrates and method for forming the sameMEDIATEK INC·Filed 2017·Granted Dec 24, 2019·3 cites·23 claims
- 3377US10580747B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Mar 3, 2020·2 cites·21 claims
- 3477US10573615B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Feb 25, 2020·2 cites·21 claims
- 3577US9881902B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Jan 30, 2018·2 cites·22 claims
- 3675US11837552B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2022·Granted Dec 5, 2023·0 cites·19 claims
- 3775US7465885B2Circuit carrier and package structure thereofVIA TECH INC·Filed 2004·Granted Dec 16, 2008·20 cites·16 claims
- 3873US2024429113A1Lidded semiconductor packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3972US10916449B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2020·Granted Feb 9, 2021·0 cites·18 claims
- 4072US10340199B2Packaging substrate with block-type via and semiconductor packages having the sameMEDIATEK INC·Filed 2015·Granted Jul 2, 2019·2 cites·20 claims
- 4171US10354974B2Structure and formation method of chip package structureMEDIATEK INC·Filed 2015·Granted Jul 16, 2019·2 cites·17 claims
- 4270US10186488B2Manufacturing method of semiconductor package and manufacturing method of semiconductor deviceMEDIATEK INC·Filed 2017·Granted Jan 22, 2019·1 cites·20 claims
- 4370US9437457B2Chip package having a patterned conducting plate and method for forming the sameMEDIATEK INC·Filed 2013·Granted Sep 6, 2016·2 cites·17 claims
- 4469US11854784B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·0 cites·12 claims
- 4568US11791266B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Oct 17, 2023·0 cites·16 claims
- 4667US12080614B2Lidded semiconductor packageMEDIATEK INC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 4766US9627311B2Chip package, package substrate and manufacturing method thereofMEDIATEK INC·Filed 2015·Granted Apr 18, 2017·1 cites·11 claims
- 4864US11469201B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 4963US9437577B2Package on package structure with pillar bump pins and related method thereofMEDIATEK INC·Filed 2014·Granted Sep 6, 2016·1 cites·10 claims
- 5061US12444715B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Oct 14, 2025·0 cites·14 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Wen-Sung Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →