Inventor · disambiguated record
Wen-Hung Hu
Also filed as: HU WEN HUNG
19 granted patents·14 pending applications·99 citations·filing 2005–2024
93Inventor score
Files withPHOENIX PREC TECHNOLOGY CORP12HU WEN-HUNG8ZHEN DING TECHNOLOGY CO LTD3HSU SHIH-PING2PHOENIX & CORP2
Top patents by PatentIndex Score
33 records- 0194US7705456B2Semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Apr 27, 2010·38 cites·7 claims
- 0279US9295150B2Method for manufacturing a printed circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Mar 22, 2016·4 cites·7 claims
- 0379US9107332B2Method for manufacturing printed circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Aug 11, 2015·4 cites·7 claims
- 0479US7674362B2Method for fabrication of a conductive bump structure of a circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Mar 9, 2010·7 cites·19 claims
- 0579US7608929B2Electrical connector structure of circuit board and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Oct 27, 2009·8 cites·5 claims
- 0678US7705471B2Conductive bump structure of circuit board and method for forming the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 27, 2010·7 cites·11 claims
- 0777US7151050B2Method for fabricating electrical connection structure of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Dec 19, 2006·7 cites·9 claims
- 0876US7350298B2Method for fabricating circuit board with conductive structurePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 1, 2008·7 cites·22 claims
- 0969US7341934B2Method for fabricating conductive bump of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Mar 11, 2008·5 cites·15 claims
- 1068US8058564B2Circuit board surface structureHU WEN-HUNG·Filed 2008·Granted Nov 15, 2011·4 cites·11 claims
- 1168US7847400B2Semiconductor package substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Dec 7, 2010·3 cites·2 claims
- 1267US7659193B2Conductive structures for electrically conductive pads of circuit board and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Feb 9, 2010·3 cites·21 claims
- 1362US2025142728A1Coil carrier board and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 1459US11495379B2Manufacturing method of an integrated driving module with energy conversion functionPHOENIX & CORP·Filed 2020·Granted Nov 8, 2022·0 cites·6 claims
- 1557US8188377B2Circuit board having electrically connecting structure and fabrication method thereofHU WEN-HUNG·Filed 2008·Granted May 29, 2012·2 cites·3 claims
- 1652US10707000B2Integrated driving module with energy conversion function and manufacturing method thereofPHOENIX & CORP·Filed 2019·Granted Jul 7, 2020·0 cites·6 claims
- 1749US9439281B2Method for manufacturing printed circuit boardZHEN DING TECH CO LTD·Filed 2013·Granted Sep 6, 2016·0 cites·9 claims
- 1848US2008265411A1Structure of packaging substrate and method for making the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1948US2006202331A1Conductive bump structure of circuit board and method for fabricating the sameHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 2047US2008036079A1Conductive connection structure formed on the surface of circuit board and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2147US2011056738A1Package substrate and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 2246US8269354B2Semiconductor package substrate structure and manufacturing method thereofHU WEN-HUNG·Filed 2010·Granted Sep 18, 2012·0 cites·6 claims
- 2345US2008257595A1Packaging substrate and method for manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2444US2006252247A1Processing apparatus for electroplating conductive bumps on organic circuit boardHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2543US2006225917A1Conductive bump structure of circuit board and fabrication method thereofHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 2643US2006252248A1Method for fabricating electrically connecting structure of circuit boardHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 2743US2006219567A1Fabrication method of conductive bump structures of circuit boardHU WEN-HUNG·Filed 2006·Application pending·0 cites
- 2843US2014146504A1Circuit board, package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2942US9439282B2Method for manufacturing printed circuit boardZHEN DING TECH CO LTD·Filed 2013·Granted Sep 6, 2016·0 cites·13 claims
- 3041US9711444B2Packaging module and substrate structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Jul 18, 2017·0 cites·15 claims
- 3141US2006252249A1Solder ball pad surface finish structure of circuit board and fabrication method thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 3236US2016066418A1Part-embedded circuit structure and method for manufacturing sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2015·Application pending·0 cites
- 3334US2012255771A1Packaging substrate and method of fabricating the sameHU WEN-HUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →