Inventor · disambiguated record
Wei Huang
Also filed as: HUANG WEI · HUANG WEI HAN
35 granted patents·29 pending applications·202 citations·filing 2007–2024
95Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO49TAIWAN SEMICONDUCTOR MFG CO LTD6CSMC TECHNOLOGIES FAB2 CO LTD1FORCECON TECH CO LTD1HUANG WEI1
Top patents by PatentIndex Score
64 records- 0197US7788477B1Methods, apparatus and articles of manufacture to control operating system images for diskless serversHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 31, 2010·162 cites·21 claims
- 0291US10518473B2Parts arrangement determination for a 3D printer build envelopeHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Dec 31, 2019·6 cites·17 claims
- 0390US11577463B2Patterns on objects in additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Feb 14, 2023·4 cites·16 claims
- 0486US10967559B23D printed object with embedded sensing deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 6, 2021·3 cites·15 claims
- 0581US9332610B2Light fixture capable of automatically controlling illuminance in an active smart mannerKUO SHU CHERN·Filed 2015·Granted May 3, 2016·14 cites·8 claims
- 0680US2024295810A1Method and system for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0779US12115733B2Unfused thermal support area in 3D fabrication systemsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Oct 15, 2024·0 cites·12 claims
- 0878US11964436B2Patterns on objects in additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Apr 23, 2024·0 cites·18 claims
- 0976US11565472B2Additively formed 3D object with conductive channelHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jan 31, 2023·1 cites·8 claims
- 1075US11207838B23D indicator objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Dec 28, 2021·2 cites·15 claims
- 1172US9129895B2In situ real-time wafer breakage detectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 8, 2015·2 cites·17 claims
- 1271US12019370B2Method and system for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1370US2022009161A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1469US12145315B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 19, 2024·0 cites·15 claims
- 1567US11981087B2Three-dimensional (3D) printed objects with fracture channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted May 14, 2024·0 cites·20 claims
- 1666US2022359204A1System, Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1764US11865769B2Weak material phasesHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Jan 9, 2024·0 cites·10 claims
- 1864US10670514B2Sensor for particle detection in a fluidWATER OPTICS TECH PTE LTD·Filed 2014·Granted Jun 2, 2020·2 cites·2 claims
- 1962US7768756B2Leakage current protection circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 3, 2010·6 cites·20 claims
- 2061US11660823B2Unfused thermal support area in 3D fabrication systemsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted May 30, 2023·0 cites·6 claims
- 2161US11364684B2Part identifier for use at manufacturing facilityHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 21, 2022·0 cites·12 claims
- 2260US11469108B2System, semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 2358US11691339B2Product framingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jul 4, 2023·0 cites·17 claims
- 2457US12269216B2Similarity-based additive manufacturing alterationsPERIDOT PRINT LLC·Filed 2020·Granted Apr 8, 2025·0 cites·15 claims
- 2557US11710327B2Identification of 3D printed objectsHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Jul 25, 2023·0 cites·9 claims
- 2657US2024315392A1Lattice structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 2756US11904535B2Hybrid part-accessory connectionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Feb 20, 2024·0 cites·9 claims
- 2856US11628627B2Additive manufacturing process to disguise physical characteristics of itemHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 18, 2023·0 cites·12 claims
- 2955US11400655B2Fabrication of objects having different degree of solidification areasHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 2, 2022·0 cites·15 claims
- 3055US11229605B2Printed support structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jan 25, 2022·0 cites·10 claims
- 3155US11144805B2Spherical identifiersHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 12, 2021·0 cites·20 claims
- 3255US2022193993A1Powder build material object labelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3355US2022402204A1Additive manufacturing with uniform property distributionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3455US2022250319A1Additive manufacturing with laser arraysHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3554US2023288173A1Composite structures for energy dissipation and methodUNIV CALIFORNIA·Filed 2021·Application pending·0 cites
- 3652US10556386B2Controlled heating for 3D printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Feb 11, 2020·0 cites·20 claims
- 3752US2022063202A1Additive manufacturing partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3852US2022024126A1Additive manufacturing process using colorant and laser fusionHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3952US2022032508A1Breakable three dimensional (3d) printed moldsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 4051US12122102B2Color surface formation by single-color 3D printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Oct 22, 2024·0 cites·13 claims
- 4151US2021205887A1Three dimensional (3d) printed molds having breakaway featuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 4251US2024418459A1Lattice structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 4351US2023146931A1Authentication surface feature in additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 4451US2023102343A1Additive manufacturing of support structures having identifiersHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 4550US11597154B2Color representation of a property of a 3D objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Mar 7, 2023·0 cites·11 claims
- 4649US11724448B2Disguising color in 3D object formationHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 15, 2023·0 cites·13 claims
- 4749US11607842B2Thermal supports for 3D features formed from particlesHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Mar 21, 2023·0 cites·13 claims
- 4849US2022276634A1Protective structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4948US2020323735A1Release module group determination for delivery of a drugHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 5048US2022227041A1Fusing build material based on thermal transferHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →