Inventor · disambiguated record
Wei-Hang Huang
Also filed as: HUANG WEI · HUANG WEI-HANG
30 granted patents·3 pending applications·91 citations·filing 2008–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20TAIWAN SEMICONDUCTOR MFG5HUANG WEI-HANG3UNITED MICROELECTRONICS CORP3SHIH HUNG-LING1
Top patents by PatentIndex Score
33 records- 0196US9196825B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 24, 2015·13 cites·20 claims
- 0295US9685604B2Magnetoresistive random access memory cell and fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 20, 2017·13 cites·20 claims
- 0393US10529916B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·6 cites·20 claims
- 0491US9620372B2HK embodied flash memory and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·6 cites·20 claims
- 0590US9614145B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·5 cites·20 claims
- 0690US9136393B2HK embodied flash memory and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 15, 2015·8 cites·20 claims
- 0784US9172033B2MRAM device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 27, 2015·4 cites·20 claims
- 0882US9564448B2Flash memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·2 cites·20 claims
- 0982US9306158B2MRAM device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 5, 2016·3 cites·20 claims
- 1082US8313959B1Hole first hardmask definitionHUANG WEI-HANG·Filed 2011·Granted Nov 20, 2012·6 cites·13 claims
- 1181US9397228B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 19, 2016·5 cites·20 claims
- 1281US2025351384A1Deep trench capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1380US10181558B2Magnetoresistive random access memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 15, 2019·2 cites·20 claims
- 1479US9142761B2Method for fabricating a magnetic tunnel junction deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·3 cites·20 claims
- 1577US9608195B2Magnetic tunnel junction deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 28, 2017·2 cites·20 claims
- 1677US9391085B2Self-aligned split gate flash memory having liner-separated spacers above the memory gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 12, 2016·3 cites·20 claims
- 1777US8519487B2Semiconductor deviceHUANG WEI-HANG·Filed 2011·Granted Aug 27, 2013·4 cites·10 claims
- 1876US8569849B2Hole first hardmask definitionHUANG WEI-HANG·Filed 2012·Granted Oct 29, 2013·4 cites·20 claims
- 1975US11258007B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 2072US10840438B2Reversed stack MTJTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 2169US2024234487A1Deep trench capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2268US9595661B2Magnetoresistive random access memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 14, 2017·1 cites·20 claims
- 2366US10825825B2Flash memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 2461US10355011B2Method for forming flash memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·0 cites·20 claims
- 2560US10937956B2Magnetoresistive random access memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 2, 2021·0 cites·20 claims
- 2660US9859295B2Method for forming flash memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·0 cites·20 claims
- 2758US8822237B2Hole first hardmask definitionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 2, 2014·1 cites·19 claims
- 2856US9048316B2Flash memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·0 cites·14 claims
- 2953US8723274B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 13, 2014·0 cites·17 claims
- 3049US12322445B2Three dimensional semiconductor memory structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Granted Jun 3, 2025·0 cites·17 claims
- 3142US7829472B2Method of forming at least an opening using a tri-layer structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Nov 9, 2010·0 cites·13 claims
- 3237US2011244398A1Patterning methodUNITED MICROELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 3336US8728949B2Method for fabricating a semiconductor deviceSHIH HUNG-LING·Filed 2010·Granted May 20, 2014·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →