Inventor · disambiguated record
Wei-Cheng Hung
Also filed as: HUNG WEI-CHENG
6 granted patents·7 pending applications·11 citations·filing 2010–2024
72Inventor score
Files withHUNG WEI-CHENG5UNITED MICROELECTRONICS CORP3CHAN YUNG-TA2SILVERSTONE TECH CO LTD2SILVERSTONE TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
13 records- 0186US10101020B2Uniformly luminous fan shield structure and fan having the sameSILVERSTONE TECH CO LTD·Filed 2017·Granted Oct 16, 2018·6 cites·20 claims
- 0274US12289916B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 29, 2025·0 cites·7 claims
- 0364USD975229STent frameHUNG WEI CHENG·Filed 2020·Granted Jan 10, 2023·5 cites·1 claims
- 0461US12040370B2Semiconductor structure and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 16, 2024·0 cites·5 claims
- 0543US11417532B2Method for reducing mismatch of semiconductor element patternsUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 16, 2022·0 cites·5 claims
- 0643US11378099B2Shell plate sound isolating structureSILVERSTONE TECH CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·12 claims
- 0738US2013145191A1Universal serial bus device and method for power managementHUNG WEI-CHENG·Filed 2012·Application pending·0 cites
- 0837US2018071556A1Fixing device for breathing tubeHUNG WEI CHENG·Filed 2017·Application pending·0 cites
- 0935US2013292096A1Heat dissipating fan and fan wheelHUNG WEI-CHENG·Filed 2012·Application pending·0 cites
- 1034US2011158108A1Etherent physical layer test system and methodCHAN YUNG-TA·Filed 2010·Application pending·0 cites
- 1133US2015079838A1Electrically connecting cableSILVERSTONE TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1229US2013145068A1Universal serial bus device for high-efficient transmissionHUNG WEI-CHENG·Filed 2012·Application pending·0 cites
- 1329US2012096194A1Universal serial bus device and bulk transfer control circuit and control method thereofCHAN YUNG-TA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →