Inventor · disambiguated record
Weng-Dah Ken
Also filed as: KEN WENG-DAH
13 granted patents·2 pending applications·35 citations·filing 2011–2025
88Inventor score
Top patents by PatentIndex Score
15 records- 0187US9748002B2System-in-package module with memoryETRON TECH INC·Filed 2014·Granted Aug 29, 2017·8 cites·11 claims
- 0286US9140978B2Semiconductor multi-project or multi-product wafer processKEN WENG-DAH·Filed 2011·Granted Sep 22, 2015·10 cites·31 claims
- 0383US9312254B2Semiconductor multi-project or multi-product wafer processKEN WENG-DAH·Filed 2015·Granted Apr 12, 2016·5 cites·22 claims
- 0482US11903755B2Non-contact angle measuring apparatusKEN WENG DAH·Filed 2020·Granted Feb 20, 2024·2 cites·9 claims
- 0579US12226246B2Ultra-precision timing clock methodKEN WENG DAH·Filed 2023·Granted Feb 18, 2025·0 cites·8 claims
- 0675US9201834B2Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip moduleETRON TECHNOLOGY INC·Filed 2012·Granted Dec 1, 2015·3 cites·23 claims
- 0774US10604203B2Green bikeKEN WENG DAH·Filed 2011·Granted Mar 31, 2020·2 cites·14 claims
- 0871US2025176925A1Non-invasive measuring/diagnosis/treatment apparatus and methodKEN WENG DAH·Filed 2025·Application pending·0 cites
- 0970US9601456B2System-in-package module and manufacture method for a system-in-package moduleETRON TECH INC·Filed 2015·Granted Mar 21, 2017·2 cites·12 claims
- 1066US9164942B2High speed memory chip module and electronics system device with a high speed memory chip moduleETRON TECHNOLOGY INC·Filed 2012·Granted Oct 20, 2015·2 cites·31 claims
- 1165US9798692B2Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip moduleETRON TECH INC·Filed 2015·Granted Oct 24, 2017·1 cites·23 claims
- 1259US11990548B2Transistor with low leakage currents and manufacturing method thereofETRON TECH INC·Filed 2020·Granted May 21, 2024·0 cites·17 claims
- 1355US9940292B2Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip moduleETRON TECH INC·Filed 2017·Granted Apr 10, 2018·0 cites·24 claims
- 1450US2017281102A1Non-contact angle measuring apparatus, mission critical inspection apparatus, non-invasive diagnosis/treatment apparatus, method for filtering matter wave from a composite particle beam, non-invasive measuring apparatus, apparatus for generating a virtual space-time lattice, and fine atomic clockKEN WENG-DAH·Filed 2017·Application pending·0 cites
- 1549US10504603B2System-in-package module with memoryETRON TECH INC·Filed 2017·Granted Dec 10, 2019·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Weng-Dah Ken files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →