Inventor · disambiguated record
Wen-Lung Lai
Also filed as: LAI WEN-LUNG
3 granted patents·6 citations·filing 2012–2016
56Inventor score
Top patents by PatentIndex Score
3 records- 0187US9721883B1Integrated circuit and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·6 cites·18 claims
- 0235US9916990B2Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structureUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Mar 13, 2018·0 cites·3 claims
- 0330US9230899B2Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structureLAI WEN-LUNG·Filed 2012·Granted Jan 5, 2016·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →