Inventor · disambiguated record
Wei Ti Lee
Also filed as: LEE WEI T · LEE WEI TI
38 granted patents·12 pending applications·490 citations·filing 2000–2025
97Inventor score
Files withNOVA MEASURING INSTR INC16APPLIED MATERIALS INC11ADESTO TECHNOLOGIES CORP5KIM HOON3LEE WEI TI3
Top patents by PatentIndex Score
50 records- 0198US6656831B1Plasma-enhanced chemical vapor deposition of a metal nitride layerAPPLIED MATERIALS INC·Filed 2000·Granted Dec 2, 2003·275 cites·28 claims
- 0294US7464917B2Ampoule splash guard apparatusAPPILED MATERIALS INC·Filed 2005·Granted Dec 16, 2008·26 cites·26 claims
- 0393US8866122B1Resistive switching devices having a buffer layer and methods of formation thereofLEE WEI TI·Filed 2012·Granted Oct 21, 2014·18 cites·36 claims
- 0491US11029148B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesNOVA MEASURING INSTR INC·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0591US10533961B2Method and system for non-destructive metrology of thin layersNOVA MEASURING INSTR INC·Filed 2016·Granted Jan 14, 2020·5 cites·18 claims
- 0691US7867900B2Aluminum contact integration on cobalt silicide junctionAPPLIED MATERIALS INC·Filed 2008·Granted Jan 11, 2011·18 cites·5 claims
- 0791US7824743B2Deposition processes for titanium nitride barrier and aluminumAPPLIED MATERIALS INC·Filed 2007·Granted Nov 2, 2010·24 cites·38 claims
- 0890US8895953B1Programmable memory elements, devices and methods having physically localized structureSHIELDS JEFFREY ALLAN·Filed 2012·Granted Nov 25, 2014·19 cites·4 claims
- 0990US8637390B2Metal gate structures and methods for forming thereofGANGULI SESHADRI·Filed 2011·Granted Jan 28, 2014·12 cites·13 claims
- 1090US7699295B2Ampoule splash guard apparatusAPPLIED MATERIALS INC·Filed 2008·Granted Apr 20, 2010·9 cites·17 claims
- 1189US10648802B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesNOVA MEASURING INSTR INC·Filed 2019·Granted May 12, 2020·2 cites·20 claims
- 1288US9952166B2Silicon germanium thickness and composition determination using combined XPS and XRF technologiesPOIS HEATH A·Filed 2017·Granted Apr 24, 2018·3 cites·20 claims
- 1388US9129945B2Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performanceLEE SANG-HYEOB·Filed 2010·Granted Sep 8, 2015·10 cites·14 claims
- 1488US2025052704A1Method and system for non-destructive metrology of thin layersNOVA MEASURING INSTR INC·Filed 2024·Application pending·0 cites
- 1587US9594035B2Silicon germanium thickness and composition determination using combined XPS and XRF technologiesPOIS HEATH A·Filed 2015·Granted Mar 14, 2017·3 cites·10 claims
- 1685US12066391B2Method and system for non-destructive metrology of thin layersNOVA MEASURING INSTR INC·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 1785US7378002B2Aluminum sputtering while biasing waferAPPLIED MATERIALS INC·Filed 2005·Granted May 27, 2008·6 cites·17 claims
- 1884US9252359B2Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereofADESTO TECHNOLOGIES CORP·Filed 2013·Granted Feb 2, 2016·4 cites·30 claims
- 1984US7857947B2Unique passivation technique for a CVD blocker plate to prevent particle formationAPPLIED MATERIALS INC·Filed 2006·Granted Dec 28, 2010·4 cites·17 claims
- 2083US12158437B2XPS metrology for process control in selective depositionNOVA MEASURING INSTR INC·Filed 2023·Granted Dec 3, 2024·0 cites·12 claims
- 2182US6528180B1Liner materialsAPPLIED MATERIALS INC·Filed 2000·Granted Mar 4, 2003·26 cites·12 claims
- 2281US10082390B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesREVERA INCORPORATED·Filed 2015·Granted Sep 25, 2018·2 cites·20 claims
- 2381US2024085174A1Feed-forward of multi-layer and multi-process information using xps and xrf technologiesNOVA MEASURING INSTR INC·Filed 2023·Application pending·0 cites
- 2480US9099633B2Solid electrolyte memory elements with electrode interface for improved performanceADESTO TECHNOLOGIES CORP·Filed 2013·Granted Aug 4, 2015·3 cites·16 claims
- 2578US11680915B2XPS metrology for process control in selective depositionNOVA MEASURING INSTR INC·Filed 2022·Granted Jun 20, 2023·0 cites·19 claims
- 2678US8847192B2Resistive switching devices having alloyed electrodes and methods of formation thereofLEE WEI TI·Filed 2012·Granted Sep 30, 2014·5 cites·32 claims
- 2777US12281893B2Characterizing and measuring in small boxes using XPS with multiple measurementsNOVA MEASURING INSTR INC·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
- 2877US11906451B2Method and system for non-destructive metrology of thin layersNOVA LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 2973US11733035B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesNOVA MEASURING INSTR INC·Filed 2021·Granted Aug 22, 2023·0 cites·7 claims
- 3072US11668663B2Method and system for non-destructive metrology of thin layersNOVA MEASURING INSTR INC·Filed 2020·Granted Jun 6, 2023·0 cites·10 claims
- 3171US11988502B2Characterizing and measuring in small boxes using XPS with multiple measurementsNOVA MEASURING INSTR INC·Filed 2022·Granted May 21, 2024·0 cites·17 claims
- 3271US11346795B2XPS metrology for process control in selective depositionNOVA MEASURING INSTR INC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 3371US2025314487A1Characterizing and measuring in small boxes using xps with multiple measurementsNOVA MEASURING INSTR INC·Filed 2025·Application pending·0 cites
- 3470US9593417B2Gas line weldment design and process for CVD aluminumAPPLIED MATERIALS INC·Filed 2013·Granted Mar 14, 2017·0 cites·5 claims
- 3569US2019033069A1Feed-forward of multi-layer and multi-process information using xps and xrf technologiesNOVA MEASURING INSTR INC·Filed 2018·Application pending·0 cites
- 3668US6716733B2CVD-PVD deposition processAPPLIED MATERIALS INC·Filed 2002·Granted Apr 6, 2004·11 cites·45 claims
- 3766US8535443B2Gas line weldment design and process for CVD aluminumLEE WEI TI·Filed 2006·Granted Sep 17, 2013·3 cites·14 claims
- 3864US10801978B2XPS metrology for process control in selective depositionNOVA MEASURING INSTR INC·Filed 2019·Granted Oct 13, 2020·0 cites·22 claims
- 3961US2018172609A1Method and system for non-destructive metrology of thin layersNOVA MEASURING INSTR LTD·Filed 2017·Application pending·0 cites
- 4052US9818939B2Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereofADESTO TECHNOLOGIES CORP·Filed 2016·Granted Nov 14, 2017·0 cites·27 claims
- 4152US2014293676A1Programmable impedance memory elements and corresponding methodsADESTO TECHNOLOGIES CORP·Filed 2014·Application pending·0 cites
- 4251US2013146468A1Chemical vapor deposition (cvd) of ruthenium films and applications for sameKIM HOON·Filed 2011·Application pending·0 cites
- 4346US11295969B2Hybridization for characterization and metrologyIBM·Filed 2018·Granted Apr 5, 2022·0 cites·17 claims
- 4446US2016043310A1Programmable resistance memory elements with electrode interface layer and memory devices including the sameADESTO TECHNOLOGIES CORP·Filed 2015·Application pending·0 cites
- 4545US11997932B2Resistive switching memory having confined filament formation and methods thereofCROSSBAR INC·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 4645US2010304027A1Substrate processing system and methods thereofAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 4745US2007113783A1Band shield for substrate processing chamberAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4841US9926639B2Methods for forming barrier/seed layers for copper interconnect structuresKIM HOON·Filed 2011·Granted Mar 27, 2018·0 cites·11 claims
- 4938US2011312148A1Chemical vapor deposition of ruthenium films containing oxygen or carbonKIM HOON·Filed 2011·Application pending·0 cites
- 5037US2022320431A1Varying nitrogen content in switching layer of two-terminal resistive switching devicesCROSSBAR INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →