Inventor · disambiguated record
Wei Li
Also filed as: LI WEI · Li wei-xiang
18 granted patents·12 pending applications·22 citations·filing 2010–2024
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8QING DING PREC ELECTRONICS HUAIAN CO LTD5SZ DJI TECHNOLOGY CO LTD5AVARY HOLDING SHENZHEN CO LTD3CSMC TECHNOLOGIES FAB2 CO LTD2
Top patents by PatentIndex Score
30 records- 0192US11947372B2Linear voltage regulator circuit and multiple output voltagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 2, 2024·2 cites·20 claims
- 0291US11041958B2Sensing assembly for autonomous drivingSZ DJI TECHNOLOGY CO LTD·Filed 2019·Granted Jun 22, 2021·9 cites·18 claims
- 0388US11480435B2Map generation systems and methodsSZ DJI TECHNOLOGY CO LTD·Filed 2019·Granted Oct 25, 2022·7 cites·20 claims
- 0486US11561562B2Linear voltage regulator circuit and multiple output voltagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 24, 2023·2 cites·20 claims
- 0577US12493310B2Linear voltage regulator circuit and multiple output voltagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 0671US2023344346A1Dual mode supply circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0770US11695339B2Dual mode supply circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 0869US2024387508A1Method of operating circuit, and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0968US2021318444A1Sensing assembly for autonomous drivingSZ DJI TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 1067US11246212B2Printed circuit board deformable in both length and widthAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Feb 8, 2022·1 cites·9 claims
- 1165US10499496B2Length- and width-deformable printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Dec 3, 2019·1 cites·6 claims
- 1262US12396088B2Circuit board assembly and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·10 claims
- 1360US12119340B2Semiconductor circuit including a tie-low circuit and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 15, 2024·0 cites·20 claims
- 1460US2022032423A1Method, device and non-transitory storage medium for measuring remaining amount of abrasive for edgerHKC CORP LTD·Filed 2021·Application pending·0 cites
- 1559US12013464B2Environment sensing system and movable platformSZ DJI TECHNOLOGY CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·19 claims
- 1655US2025252975A1Method, apparatus, device, media and program product for processing multimedia resourceBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1754US11320611B2Surface mounting techniques for fiber optics printed circuit board assemblies using metal coatings and tabsFINISAR CORP·Filed 2020·Granted May 3, 2022·0 cites·18 claims
- 1852US11509224B2Dual mode supply circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 1951US11744004B2Circuit board and method of manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·16 claims
- 2049US2022225511A1Rigid-flexible circuit board with easy and simple manufacture and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 2148US11266013B2Rigid-flex printed circuit board and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·19 claims
- 2248US11140776B2Method of making a rigid/flex circuit boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·6 claims
- 2345US12046664B2Vertical semiconductor structure with integrated sampling structure and method for manufacturing sameWUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·16 claims
- 2440US2019163958A1Methods and associated systems for grid analysisSZ DJI TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 2537US2018287158A1Negative electrode plate, method for producing the same, and secondary battery using the sameCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2018·Application pending·0 cites
- 2636US10765013B2Method for manufacturing rigid-flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 2730US2018012890A1Semiconductor device and manufacturing method thereofCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2015·Application pending·0 cites
- 2830US2018019159A1Semiconductor device and manufacturing method therefor, and electronic deviceCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2016·Application pending·0 cites
- 2930US2012000379A1Method for producing a stamp for hot embossingGREENER JESSE·Filed 2010·Application pending·0 cites
- 3028US2017222012A1Semiconductor device and manufacturing method thereforCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →