Inventor · disambiguated record
Weimin Li
Also filed as: LI WEIMIN · LI WEIMIN M
139 granted patents·52 pending applications·3,662 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
191 records- 0199US6756293B2Combined gate cap or digit line and spacer deposition using HDPMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 29, 2004·495 cites·35 claims
- 0299US6281072B1Multiple step methods for forming conformal layersMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 28, 2001·227 cites·13 claims
- 0399US6218288B1Multiple step methods for forming conformal layersMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 17, 2001·542 cites·53 claims
- 0498US9337054B2Precursors for silicon dioxide gap fillHUNKS WILLIAM·Filed 2008·Granted May 10, 2016·443 cites·20 claims
- 0598US7910177B2Sequential pulse depositionMOSAID TECHNOLOGIES INC·Filed 2006·Granted Mar 22, 2011·78 cites·38 claims
- 0698US6835995B2Low dielectric constant material for integrated circuit fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 28, 2004·226 cites·9 claims
- 0797US11422096B2Surface topography measurement apparatus and methodAPPLIED MATERIALS INC·Filed 2020·Granted Aug 23, 2022·6 cites·12 claims
- 0897US6596583B2Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layersMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·96 cites·9 claims
- 0997US6383951B1Low dielectric constant material for integrated circuit fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted May 7, 2002·325 cites·33 claims
- 1096US6613656B2Sequential pulse depositionMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 2, 2003·89 cites·33 claims
- 1195US7205248B2Method of eliminating residual carbon from flowable oxide fillMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 17, 2007·64 cites·64 claims
- 1295US6930058B2Method of depositing a silicon dioxide comprising layer doped with at least one of P, B and GeMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 16, 2005·88 cites·54 claims
- 1393US6198144B1Passivation of sidewalls of a word line stackMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·97 cites·32 claims
- 1493US6156674ASemiconductor processing methods of forming insulative materialsMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 5, 2000·129 cites·50 claims
- 1591US11974324B2Two-step random access procedure in wireless systemsZTE CORP·Filed 2021·Granted Apr 30, 2024·2 cites·20 claims
- 1690US7053010B2Methods of depositing silicon dioxide comprising layers in the fabrication of integrated circuitry, methods of forming trench isolation, and methods of forming arrays of memory cellsMICRON TECHNOLOGY INC·Filed 2004·Granted May 30, 2006·39 cites·165 claims
- 1789US8330136B2High concentration nitrogen-containing germanium telluride based memory devices and processes of makingZHENG JUN-FEI·Filed 2009·Granted Dec 11, 2012·9 cites·20 claims
- 1889US6539341B1Method and apparatus for log information management and reporting3COM CORP·Filed 2000·Granted Mar 25, 2003·50 cites·13 claims
- 1988US8093140B2Amorphous Ge/Te deposition processCHEN PHILIP S H·Filed 2008·Granted Jan 10, 2012·11 cites·20 claims
- 2088US6951709B2Method of fabricating a semiconductor multilevel interconnect structureMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 4, 2005·35 cites·42 claims
- 2187US7298024B2Transparent amorphous carbon structure in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 20, 2007·7 cites·31 claims
- 2286US7341957B2Masking structure having multiple layers including amorphous carbon layerMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 11, 2008·9 cites·58 claims
- 2385US10186570B2ALD processes for low leakage current and low equivalent oxide thickness BiTaO filmsENTEGRIS INC·Filed 2014·Granted Jan 22, 2019·9 cites·14 claims
- 2485US7678460B2Intermediate semiconductor device structures using photopatternable, dielectric materialsMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 16, 2010·7 cites·45 claims
- 2584US7259079B2Methods for filling high aspect ratio trenches in semiconductor layersMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 21, 2007·11 cites·26 claims
- 2684US6833576B2Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layersMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 21, 2004·20 cites·13 claims
- 2784US6589611B1Deposition and chamber treatment methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 8, 2003·27 cites·68 claims
- 2883US6136690AIn situ plasma pre-deposition wafer treatment in chemical vapor deposition technology for semiconductor integrated circuit applicationsMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 24, 2000·43 cites·56 claims
- 2982US10826557B2Data transmission method, transmitter, receiver, storage mediumZTE CORP·Filed 2017·Granted Nov 3, 2020·3 cites·19 claims
- 3082US7220683B2Transparent amorphous carbon structure in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2004·Granted May 22, 2007·16 cites·61 claims
- 3182US7129180B2Masking structure having multiple layers including an amorphous carbon layerMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 31, 2006·22 cites·41 claims
- 3282US7018469B2Atomic layer deposition methods of forming silicon dioxide comprising layersMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 28, 2006·22 cites·49 claims
- 3381US6368988B1Combined gate cap or digit line and spacer deposition using HDPMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 9, 2002·48 cites·95 claims
- 3479US12069801B2Phase shifter, antenna, and base stationHUAWEI TECH CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·9 claims
- 3579US7855154B2Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materialsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 21, 2010·4 cites·21 claims
- 3679US7470635B2Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry, methods of forming trench isolation in the fabrication of integrated circuitry, methods of depositing silicon dioxide-comprising layers in the fabrication of integrated circuitry, and methods of forming bit line over capacitor arrays of memory cellsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 30, 2008·5 cites·34 claims
- 3779US6889141B2Method and system to flexibly calculate hydraulics and hydrology of watersheds automaticallyFiled 2003·Granted May 3, 2005·35 cites·16 claims
- 3878US11974233B2Power determination method and apparatus, terminal and storage mediumZTE CORP·Filed 2020·Granted Apr 30, 2024·1 cites·17 claims
- 3978US10475575B2In-situ oxidized NiO as electrode surface for high k MIM deviceENTEGRIS INC·Filed 2013·Granted Nov 12, 2019·1 cites·14 claims
- 4078US6140230AMethods of forming metal nitride and silicide structuresMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 31, 2000·42 cites·45 claims
- 4177US7632737B2Protection in integrated circuitsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 15, 2009·6 cites·37 claims
- 4276US9963898B2Underwater cleaning robotNINGBO PULEFEI INTELLIGENT TECH CO LTD·Filed 2017·Granted May 8, 2018·4 cites·8 claims
- 4376US9443736B2Silylene compositions and methods of use thereofENTEGRIS INC·Filed 2013·Granted Sep 13, 2016·4 cites·18 claims
- 4476US6982207B2Methods for filling high aspect ratio trenches in semiconductor layersMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 3, 2006·20 cites·29 claims
- 4576US2025129485A1Coatings for enhancement of properties and performance of substrate articles and apparatusHENDRIX BRYAN C·Filed 2024·Application pending·0 cites
- 4675USD875440SGaming deskLI WEIMIN·Filed 2018·Granted Feb 18, 2020·15 cites·1 claims
- 4775US7273793B2Methods of filling gaps using high density plasma chemical vapor depositionMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 25, 2007·1 cites·19 claims
- 4874US11720013B2Graded interface in Bragg reflectorAPPLIED MATERIALS INC·Filed 2022·Granted Aug 8, 2023·0 cites·16 claims
- 4974US8367575B2High-refractivity low-dispersion optical glassCDGM GLASS CO LTD·Filed 2009·Granted Feb 5, 2013·4 cites·21 claims
- 5074US7060637B2Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materialsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·11 cites·20 claims
Showing the top 50 of 191 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →