Inventor · disambiguated record
Wen-An Liang
Also filed as: Liang Wen-An
17 granted patents·3 pending applications·123 citations·filing 2015–2024
91Inventor score
Files withUNITED MICROELECTRONICS CORP20
Top patents by PatentIndex Score
20 records- 0197US9607985B1Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Mar 28, 2017·46 cites·18 claims
- 0297US9608062B1Semiconductor structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 28, 2017·47 cites·20 claims
- 0396US10475709B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·16 cites·10 claims
- 0490US9824931B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 21, 2017·7 cites·12 claims
- 0588US10679903B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·4 cites·12 claims
- 0685US12439681B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Oct 7, 2025·0 cites·10 claims
- 0779US11972984B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 30, 2024·0 cites·9 claims
- 0875US9786502B2Method for forming fin structures for non-planar semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 10, 2017·2 cites·10 claims
- 0970US10892194B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 12, 2021·0 cites·20 claims
- 1069US11569133B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 31, 2023·0 cites·2 claims
- 1169US10741455B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 11, 2020·0 cites·20 claims
- 1265US9653402B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 16, 2017·1 cites·7 claims
- 1364US10607897B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 31, 2020·0 cites·10 claims
- 1458US10658458B2Semiconductor structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·0 cites·10 claims
- 1558US2025098252A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1656US2025151366A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1752US10043868B2Semiconductor structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 7, 2018·0 cites·10 claims
- 1851US10032675B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 24, 2018·0 cites·7 claims
- 1940US10312146B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 4, 2019·0 cites·18 claims
- 2033US2016276429A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →