Inventor · disambiguated record
Wen-Hsiang Liao
Also filed as: LIAO WEN-HSIANG
11 granted patents·17 pending applications·11 citations·filing 2008–2025
82Inventor score
Top patents by PatentIndex Score
28 records- 0193US12300556B2Electronic device and method for manufacturing the sameINNOLUX CORP·Filed 2021·Granted May 13, 2025·2 cites·18 claims
- 0291US11769685B2Manufacturing method of semiconductor packageINNOLUX CORP·Filed 2021·Granted Sep 26, 2023·2 cites·17 claims
- 0387US11150189B1Methods of manufacturing a light source carrier and an electronic device, and a light source qualification methodINNOLUX CORP·Filed 2019·Granted Oct 19, 2021·7 cites·20 claims
- 0474US2025029910A1Electronic componentINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0573US2025014913A1Electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0672US2025038089A1Electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0771US2025266302A1Electronic deviceINNOLUX CORP·Filed 2025·Application pending·0 cites
- 0870US2025273551A1Package structureINNOLUX CORP·Filed 2025·Application pending·0 cites
- 0968US12131917B2Manufacturing method of package structureINNOLUX CORP·Filed 2021·Granted Oct 29, 2024·0 cites·19 claims
- 1067US12142554B2Electronic component and manufacturing method thereofINNOLUX CORP·Filed 2021·Granted Nov 12, 2024·0 cites·19 claims
- 1165US12148685B2Redistribution layer structureINNOLUX CORP·Filed 2021·Granted Nov 19, 2024·0 cites·17 claims
- 1262US12322686B2Redistribution layer structureINNOLUX CORP·Filed 2021·Granted Jun 3, 2025·0 cites·11 claims
- 1360US2025140671A1Electronic device and manufacturing method thereofINNOLUX CORP·Filed 2024·Application pending·0 cites
- 1459US12313616B2Solution detectorINNOLUX CORP·Filed 2021·Granted May 27, 2025·0 cites·17 claims
- 1557US2024421031A1Electronic device and manufacturing method thereofINNOLUX CORP·Filed 2024·Application pending·0 cites
- 1656US2024339392A1Electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 1755US12489048B2Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layerINNOLUX CORP·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 1855US2024347496A1Electronic device and manufacturing method of electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 1953US2024429193A1Electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 2052US12482778B2Electronic device and method of fabricating an electronic deviceINNOLUX CORP·Filed 2022·Granted Nov 25, 2025·0 cites·9 claims
- 2152US2024332158A1Electronic device and method of manufacturing the sameINNOLUX CORP·Filed 2024·Application pending·0 cites
- 2251US2025379159A1Electronic deviceINNOLUX CORP·Filed 2025·Application pending·0 cites
- 2350US2025379160A1Electronic device and method for manufacturing the sameINNOLUX CORP·Filed 2025·Application pending·0 cites
- 2450US2023117955A1Electronic device and method of fabricating electronic deviceINNOLUX CORP·Filed 2022·Application pending·0 cites
- 2548US2025379175A1Semiconductor device and manufacturing method thereofINNOLUX CORP·Filed 2025·Application pending·0 cites
- 2646US2024153860A1Electronic deviceINNOLUX CORP·Filed 2022·Application pending·0 cites
- 2744US2010049680A1Method for projecting wafer product overlay error and wafer product critical dimensionINOTERA MEMORIES INC·Filed 2008·Application pending·0 cites
- 2830US9929051B1Wafer dicing methodCHIPBOND TECHNOLOGY CORP·Filed 2016·Granted Mar 27, 2018·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →