Inventor · disambiguated record
Wen-Liang Lien
Also filed as: LIEN WEN-LIANG
3 granted patents·1 pending application·0 citations·filing 2004–2022
44Inventor score
Top patents by PatentIndex Score
4 records- 0165US12114427B2Method for fabricating assemble substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·11 claims
- 0253US11382214B2Electronic package, assemble substrate, and method for fabricating the assemble substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·8 claims
- 0334US7135400B2Damascene process capable of avoiding via resist poisoningUNITED MICROELECTRONICS CORP·Filed 2004·Granted Nov 14, 2006·0 cites·11 claims
- 0430US2005239286A1Two-step stripping method for removing via photoresist during the fabrication of partial-via dual damascene featuresWU CHIH-NING·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →