Inventor · disambiguated record
Wen-Yi Lin
Also filed as: LIN WEN · LIN WEN-YI
63 granted patents·25 pending applications·1,129 citations·filing 1991–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD35DARWIN PRECISIONS CORP9LIN WEN-YI9MICROCOATING TECHNOLOGIES INC4FAR EASTERN TEXTILE LTD3
Top patents by PatentIndex Score
88 records- 0198US8941248B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·70 cites·20 claims
- 0297US6207522B1Formation of thin film capacitorsMICROCOATING TECHNOLOGIES·Filed 1998·Granted Mar 27, 2001·154 cites·11 claims
- 0394US12327782B2Systems for semiconductor package mounting with improved co-planarityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 0494US6728092B2Formation of thin film capacitorsSHIPLEY CO LLC·Filed 2001·Granted Apr 27, 2004·75 cites·31 claims
- 0594US6212078B1Nanolaminated thin film circuitry materialsMICROCOATING TECHNOLOGIES·Filed 1999·Granted Apr 3, 2001·96 cites·42 claims
- 0694US5860599AShower head assemblyFiled 1997·Granted Jan 19, 1999·128 cites·6 claims
- 0793US11764118B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0893US9881908B2Integrated fan-out package on package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·11 cites·18 claims
- 0993US6433993B1Formation of thin film capacitorsMICROCOATING TECHNOLOGIES INC·Filed 1999·Granted Aug 13, 2002·104 cites·29 claims
- 1091US10269602B1Wafer warpage inspection system and method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 1191US9721868B2Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·9 cites·20 claims
- 1291US9583474B2Package on packaging structure and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·7 cites·20 claims
- 1391US8970029B2Thermally enhanced heat spreader for flip chip packagingLIN PO-YAO·Filed 2010·Granted Mar 3, 2015·17 cites·20 claims
- 1491US8901732B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 1590US11011447B2Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
- 1689US12512331B2Dummy through vias for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·20 claims
- 1789US9502323B2Method of forming encapsulated semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·6 cites·20 claims
- 1889US8847369B2Packaging structures and methods for semiconductor devicesYEW MING-CHIH·Filed 2012·Granted Sep 30, 2014·12 cites·20 claims
- 1988US7766260B2ShowerheadLIN WEN-YI·Filed 2008·Granted Aug 3, 2010·22 cites·6 claims
- 2086US10790164B1Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·4 cites·20 claims
- 2186US7301594B2Optical compensator for a liquid crystal displayFAR EASTERN TEXTILE LTD·Filed 2005·Granted Nov 27, 2007·20 cites·34 claims
- 2285US12278156B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 2385US6500350B1Formation of thin film resistorsMORTON INT INC·Filed 2001·Granted Dec 31, 2002·37 cites·11 claims
- 2485US6034015ACeramic compositions for microwave wireless communicationGEORGIA TECH RES INST·Filed 1998·Granted Mar 7, 2000·58 cites·15 claims
- 2584US9748156B1Semiconductor package assembly, semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
- 2684US8462510B2Board-level package with tuned mass damping structureLIN WEN-YI·Filed 2011·Granted Jun 11, 2013·7 cites·20 claims
- 2784US2024379488A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2883US11868184B2Metal backplate and foldable display using the sameDARWIN PRECISIONS CORP·Filed 2021·Granted Jan 9, 2024·2 cites·9 claims
- 2983US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 3083US7524739B2Method of improving a surface of a semiconductor substrateSOITEC SILICON ON INSULATOR·Filed 2007·Granted Apr 28, 2009·9 cites·19 claims
- 3182US11685985B2Method of manufacturing metal maskDARWIN PRECISIONS CORP·Filed 2022·Granted Jun 27, 2023·1 cites·5 claims
- 3282US6193911B1Precursor solution compositions for electronic devices using CCVDMORTON INT INC·Filed 1998·Granted Feb 27, 2001·61 cites·21 claims
- 3380USD832839SDisplayDARWIN PRECISIONS CORP·Filed 2017·Granted Nov 6, 2018·21 cites·1 claims
- 3480US6329899B1Formation of thin film resistorsMICROCOATING TECHNOLOGIES INC·Filed 1998·Granted Dec 11, 2001·41 cites·16 claims
- 3580US2024302410A1Probe head structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3680US2025364353A1Multi-die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3779US12119276B2Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 3879US10126363B2Flip-flop circuit and scan chain using the sameMEDIATEK INC·Filed 2017·Granted Nov 13, 2018·3 cites·20 claims
- 3979US2025349670A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4078US8779582B2Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areasLIN WEN-YI·Filed 2011·Granted Jul 15, 2014·5 cites·27 claims
- 4178US2025349749A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4278US2024379475A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4378US2025366014A1Heterostructure channel layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4477US9548281B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 17, 2017·5 cites·20 claims
- 4575US9543284B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·20 claims
- 4675US8976529B2Lid design for reliability enhancement in flip chip packageLIN WEN-YI·Filed 2011·Granted Mar 10, 2015·4 cites·20 claims
- 4774US11862528B2Method for forming semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 4874US7033637B1Epitaxial thin filmsMICROCOATING TECHNOLOGIES INC·Filed 2000·Granted Apr 25, 2006·18 cites·3 claims
- 4972US2025266338A1Systems for semiconductor package mounting with improved co-planarityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5070US12019097B2Method for forming probe head structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →