Inventor · disambiguated record
Wei-Hung Lin
Also filed as: LIN WEI · LIN WEI HUNG
246 granted patents·30 pending applications·711 citations·filing 2006–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD115PHISON ELECTRONICS CORP98TAIWAN SEMICONDUCTOR MFG19LIN WEI-HUNG9CHEN MENG-TSE8
Top patents by PatentIndex Score
276 records- 0197US10014260B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·14 cites·20 claims
- 0297US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0397US8381965B2Thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 26, 2013·30 cites·14 claims
- 0496US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 0596US9837435B1Three-dimensional non-volatile memory structure and manufacturing method thereofPHISON ELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·31 cites·20 claims
- 0695US9799631B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 24, 2017·8 cites·20 claims
- 0795US9715429B1Decoding method, memory storage device and memory control circuit unitPHISON ELECTRONICS CORP·Filed 2016·Granted Jul 25, 2017·26 cites·24 claims
- 0894US12015002B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 0994US10867932B2Method for manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·3 cites·20 claims
- 1094US9559064B2Warpage control in package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·11 cites·20 claims
- 1193US9865574B2Alignment in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
- 1292US12174758B2Computer system having multiple nodes with flexible configurable architectureQUANTA COMP INC·Filed 2023·Granted Dec 24, 2024·3 cites·19 claims
- 1392US12027435B2Packages including multiple encapsulated substrate blocks and overlapping redistribution structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·1 cites·20 claims
- 1492US10049894B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·7 cites·20 claims
- 1592US9559005B2Methods of packaging and dicing semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·14 cites·20 claims
- 1692US8476110B2Method of manufacturing storage apparatusPHISON ELECTRONICS CORP·Filed 2013·Granted Jul 2, 2013·14 cites·17 claims
- 1792US8393907B2Storage apparatus and method of manufacturing the sameLIN WEI-HUNG·Filed 2010·Granted Mar 12, 2013·16 cites·9 claims
- 1891US11322360B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 1991US9892799B1Read voltage tracking method, memory storage device and memory control circuit unitPHISON ELECTRONICS CORP·Filed 2017·Granted Feb 13, 2018·13 cites·18 claims
- 2091US9349663B2Package-on-package structure having polymer-based material for warpage controlCHEN MENG-TSE·Filed 2012·Granted May 24, 2016·9 cites·20 claims
- 2191US9219030B2Package on package structures and methods for forming the sameYU CHEN-HUA·Filed 2012·Granted Dec 22, 2015·9 cites·16 claims
- 2290US11474623B1Stylus pens with batteriesHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Oct 18, 2022·3 cites·9 claims
- 2390US9312013B1Configuration method of erase operation, memory controlling circuit unit and memory storage devicePHISON ELECTRONICS CORP·Filed 2015·Granted Apr 12, 2016·12 cites·25 claims
- 2490US9263412B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·8 cites·19 claims
- 2589US7351067B2Coaxial cable connecting apparatusSPEED TECH CORP·Filed 2006·Granted Apr 1, 2008·36 cites·7 claims
- 2688US9412689B2Semiconductor packaging structure and methodLIN CHUN-CHENG·Filed 2012·Granted Aug 9, 2016·6 cites·20 claims
- 2788US9019770B2Data reading method, and control circuit, memory module and memory storage apparatus and memory module using the samePHISON ELECTRONICS CORP·Filed 2013·Granted Apr 28, 2015·12 cites·25 claims
- 2887US11264342B2Package on package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·2 cites·20 claims
- 2987US10707084B2Method of manufacturing wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 7, 2020·3 cites·20 claims
- 3087US10535609B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·3 cites·20 claims
- 3187US9711470B2Package on package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·4 cites·20 claims
- 3287US9425157B2Substrate and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·5 cites·17 claims
- 3387US9361024B1Memory cell programming method, memory control circuit unit and memory storage apparatusPHISON ELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·6 cites·36 claims
- 3487US9269687B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·7 cites·18 claims
- 3587US7740494B2Data storage apparatusPHISON ELECTRONICS CORP·Filed 2007·Granted Jun 22, 2010·27 cites·14 claims
- 3687US2025364468A1Semiconductor device structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3786US12300652B2Substrate and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 3886US10159874B1Luminous ballBLACKSTAR CORP·Filed 2018·Granted Dec 25, 2018·9 cites·12 claims
- 3986US9891991B2Decoding method, memory storage device and memory control circuit unitPHISON ELECTRONICS CORP·Filed 2016·Granted Feb 13, 2018·6 cites·27 claims
- 4086US2024371647A1Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4186US2025343135A1Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4285US11532564B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·1 cites·20 claims
- 4385US10629508B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·2 cites·20 claims
- 4485US9941221B2Warpage control in package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·3 cites·20 claims
- 4585US9397062B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·5 cites·20 claims
- 4685US9343386B2Alignment in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·6 cites·16 claims
- 4785US9252135B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·4 cites·20 claims
- 4884US10685711B1Decoding method, memory controlling circuit unit and memory storage devicePHISON ELECTRONICS CORP·Filed 2019·Granted Jun 16, 2020·8 cites·34 claims
- 4984US10475679B2Semiconductor processing boat design with pressure sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·20 claims
- 5084US9627355B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
Showing the top 50 of 276 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →