Inventor · disambiguated record
Wen Liu
Also filed as: LIU WEN · Liu wen ju
1 granted patent·2 pending applications·0 citations·filing 2016–2025
5Inventor score
Top patents by PatentIndex Score
3 records- 0144US2025309022A1Annular stress reduction structure for semiconductor substrateMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0242US10700013B2IC wafer for identification of circuit dies after dicingGLOBALFOUNDRIES INC·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 0335US2018138209A1Semiconductor substrate with metallic doped buried oxideGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →