Inventor · disambiguated record
Wei Liu
Also filed as: LIU WEI · LIU WEI-JEAN
71 granted patents·36 pending applications·1,836 citations·filing 1999–2025
99Inventor score
Files withAPPLIED MATERIALS INC47IQM FINLAND OY8LIU WEI5AGILENT TECHNOLOGIES INC3NUVOTON TECHNOLOGY CORP3
Top patents by PatentIndex Score
107 records- 0199US6924191B2Method for fabricating a gate structure of a field effect transistorAPPLIED MATERIALS INC·Filed 2003·Granted Aug 2, 2005·452 cites·20 claims
- 0297US6677242B1Integrated shallow trench isolation approachAPPLIED MATERIALS INC·Filed 2000·Granted Jan 13, 2004·242 cites·11 claims
- 0396US11744368B2Mechanical extension apparatus for reclining seat having extendable chair unitREMACRO TECH CO LTD·Filed 2021·Granted Sep 5, 2023·9 cites·18 claims
- 0496US6235643B1Method for etching a trench having rounded top and bottom corners in a silicon substrateAPPLIED MATERIALS INC·Filed 1999·Granted May 22, 2001·305 cites·32 claims
- 0595US8137463B2Dual zone gas injection nozzleLIU WEI·Filed 2007·Granted Mar 20, 2012·36 cites·8 claims
- 0695US7064078B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemeAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·114 cites·23 claims
- 0794US8999106B2Apparatus and method for controlling edge performance in an inductively coupled plasma chamberLIU WEI·Filed 2007·Granted Apr 7, 2015·43 cites·17 claims
- 0893US6960416B2Method and apparatus for controlling etch processes during fabrication of semiconductor devicesAPPLIED MATERIALS INC·Filed 2003·Granted Nov 1, 2005·65 cites·18 claims
- 0992US7718081B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemesAPPLIED MATERIALS INC·Filed 2006·Granted May 18, 2010·17 cites·20 claims
- 1091USD1034491SEdge ringAPPLIED MATERIALS INC·Filed 2020·Granted Jul 9, 2024·17 cites·1 claims
- 1191US11605586B2Airbridge for making connections on superconducting chip, and method for producing superconducting chips with airbridgesIQM FINLAND OY·Filed 2020·Granted Mar 14, 2023·3 cites·20 claims
- 1291US7498106B2Method and apparatus for controlling etch processes during fabrication of semiconductor devicesAPPLIED MATERIALS INC·Filed 2005·Granted Mar 3, 2009·18 cites·18 claims
- 1391US6380095B1Silicon trench etch using silicon-containing precursors to reduce or avoid mask erosionAPPLIED MATERIALS INC·Filed 2000·Granted Apr 30, 2002·66 cites·21 claims
- 1491US6180533B1Method for etching a trench having rounded top corners in a silicon substrateAPPLIED MATERIALS INC·Filed 2000·Granted Jan 30, 2001·71 cites·25 claims
- 1590US11380575B2Film thickness uniformity improvement using edge ring and bias electrode geometryAPPLIED MATERIALS INC·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 1689US11437271B2Seamless gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Sep 6, 2022·2 cites·15 claims
- 1786US7094613B2Method for controlling accuracy and repeatability of an etch processAPPLIED MATERIALS INC·Filed 2003·Granted Aug 22, 2006·36 cites·20 claims
- 1885US7368394B2Etch methods to form anisotropic features for high aspect ratio applicationsAPPLIED MATERIALS INC·Filed 2006·Granted May 6, 2008·11 cites·20 claims
- 1985US6767824B2Method of fabricating a gate structure of a field effect transistor using an alpha-carbon maskFiled 2003·Granted Jul 27, 2004·34 cites·22 claims
- 2084US8481433B2Methods and apparatus for forming nitrogen-containing layersBEVAN MALCOLM J·Filed 2010·Granted Jul 9, 2013·6 cites·21 claims
- 2184US6911399B2Method of controlling critical dimension microloading of photoresist trimming process by selective sidewall polymer depositionAPPLIED MATERIALS INC·Filed 2003·Granted Jun 28, 2005·29 cites·17 claims
- 2284US6858361B2Methodology for repeatable post etch CD in a production toolFiled 2002·Granted Feb 22, 2005·34 cites·33 claims
- 2383US6566270B1Integration of silicon etch and chamber cleaning processesAPPLIED MATERIALS INC·Filed 2000·Granted May 20, 2003·31 cites·26 claims
- 2480US6458671B1Method of providing a shallow trench in a deep-trench deviceAPPLIED MATERIALS INC·Filed 2001·Granted Oct 1, 2002·26 cites·24 claims
- 2579US6589879B2Nitride open etch process based on trifluoromethane and sulfur hexafluorideAPPLIED MATERIALS INC·Filed 2001·Granted Jul 8, 2003·23 cites·29 claims
- 2677US6924088B2Method and system for realtime CD microloading controlAPPLIED MATERIALS INC·Filed 2003·Granted Aug 2, 2005·19 cites·59 claims
- 2775US8546273B2Methods and apparatus for forming nitrogen-containing layersBEVAN MALCOLM J·Filed 2011·Granted Oct 1, 2013·3 cites·19 claims
- 2874US12487121B2Methods for calibrating an optical emission spectrometerAPPLIED MATERIALS INC·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 2974US12261047B2Doping techniquesAPPLIED MATERIALS INC·Filed 2022·Granted Mar 25, 2025·0 cites·16 claims
- 3074US8062472B2Method of correcting baseline skew by a novel motorized source coil assemblyLIU WEI·Filed 2007·Granted Nov 22, 2011·3 cites·19 claims
- 3173US2025309899A1Level shifterNUVOTON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3272US8501626B2Methods for high temperature etching a high-K material gate structureLIU WEI·Filed 2008·Granted Aug 6, 2013·4 cites·13 claims
- 3372US6849151B2Monitoring substrate processing by detecting reflectively diffracted lightFiled 2002·Granted Feb 1, 2005·11 cites·9 claims
- 3471US12266560B2Film thickness uniformity improvement using edge ring and bias electrode geometryAPPLIED MATERIALS INC·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 3571US8722547B2Etching high K dielectrics with high selectivity to oxide containing layers at elevated temperatures with BC13 based etch chemistriesMANI RADHIKA·Filed 2007·Granted May 13, 2014·5 cites·11 claims
- 3671US6491835B1Metal mask etching of siliconAPPLIED MATERIALS INC·Filed 1999·Granted Dec 10, 2002·39 cites·13 claims
- 3770US7605398B2Apparatus of high dynamic-range CMOS image sensor and method thereofNAT UNIV CHUNG CHENG·Filed 2005·Granted Oct 20, 2009·3 cites·20 claims
- 3869US7250319B2Method of fabricating quantum featuresAPPLIED MATERIALS INC·Filed 2004·Granted Jul 31, 2007·12 cites·57 claims
- 3968US8871645B2Semiconductor devices suitable for narrow pitch applications and methods of fabrication thereofGANGULY UDAYAN·Filed 2009·Granted Oct 28, 2014·3 cites·12 claims
- 4068US2024387951A1Battery component and assembly process thereofFARASIS ENERGY GANZHOU CO LTD·Filed 2024·Application pending·0 cites
- 4167US7780862B2Device and method for etching flash memory gate stacks comprising high-k dielectricAPPLIED MATERIALS INC·Filed 2006·Granted Aug 24, 2010·2 cites·11 claims
- 4267US7250373B2Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrateAPPLIED MATERIALS INC·Filed 2004·Granted Jul 31, 2007·8 cites·4 claims
- 4366US7964512B2Method for etching high dielectric constant materialsAPPLIED MATERIALS INC·Filed 2005·Granted Jun 21, 2011·3 cites·30 claims
- 4464US7262865B2Method and apparatus for controlling a calibration cycle or a metrology toolAPPLIED MATERIALS INC·Filed 2004·Granted Aug 28, 2007·9 cites·15 claims
- 4562US11443948B2Doping techniquesAPPLIED MATERIALS INC·Filed 2019·Granted Sep 13, 2022·0 cites·19 claims
- 4662US9012336B2Method for conformal treatment of dielectric films using inductively coupled plasmaAPPLIED MATERIALS INC·Filed 2013·Granted Apr 21, 2015·1 cites·18 claims
- 4762US7482178B2Chamber stability monitoring using an integrated metrology toolAPPLIED MATERIALS INC·Filed 2003·Granted Jan 27, 2009·8 cites·6 claims
- 4862US7234232B2Methods for designing and tuning one or more packaged integrated circuitsAGILENT TECHNOLOGIES INC·Filed 2005·Granted Jun 26, 2007·2 cites·8 claims
- 4962US2025183036A1Selective silicon nitride with treatment for contact formation in logic or memory devicesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 5061US12161225B2Mechanical extension apparatus for extendable seat and extendable seatREMACRO TECH CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·18 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →