Inventor · disambiguated record
Wei-Ta Lo
Also filed as: LO WEI-TA
23 granted patents·1 pending application·457 citations·filing 1999–2004
96Inventor score
Files withFOXCONN PREC COMPONENTS CO LTD13HON HAI PREC IND CO LTD6FOXCONN PRECISION COMPONENTS C2FOXCONN PRECISON COMPONENTS CO1FU ZHUN PRECISION IND SHENZHEN1
Top patents by PatentIndex Score
24 records- 0186US6341644B1Heat sink assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Jan 29, 2002·48 cites·13 claims
- 0285US6304452B1Clip for securing heat sink to electronic device packageFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Oct 16, 2001·40 cites·9 claims
- 0383US6295203B1Heat sink clip assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Sep 25, 2001·36 cites·6 claims
- 0481US6418018B1Heat removal systemFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Jul 9, 2002·32 cites·4 claims
- 0579US6480384B2Clip for heat sinkHON HAI PREC IND CO LTD·Filed 2000·Granted Nov 12, 2002·29 cites·20 claims
- 0676US6415852B1Heat sink assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 2001·Granted Jul 9, 2002·23 cites·8 claims
- 0776US6373701B1Heat dissipation assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Apr 16, 2002·23 cites·10 claims
- 0874US6145586AHeat sink module with heat dissipating deviceFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted Nov 14, 2000·45 cites·6 claims
- 0972US6813155B2Heat sink clip with interchangeable operating bodyHON HAI PREC IND CO LTD·Filed 2003·Granted Nov 2, 2004·18 cites·18 claims
- 1070US6311765B1Heat sink assemblyHON HAI PREC IND CO LTD·Filed 2000·Granted Nov 6, 2001·17 cites·10 claims
- 1169US6111752ADevice for fastening a heat sink to a heat-generating electrical componentFOXCONN PRECISION COMPONENTS C·Filed 1999·Granted Aug 29, 2000·36 cites·11 claims
- 1267US7218525B2Fastener for heat sinkFU ZHUN PRECISION IND SHENZHEN·Filed 2004·Granted May 15, 2007·13 cites·14 claims
- 1366US6370024B1Heat sink clipFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Apr 9, 2002·13 cites·17 claims
- 1458US6341065B1Heat sink clipFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Jan 22, 2002·8 cites·7 claims
- 1558US6243266B1Locking device for CPU packages of different thicknessesFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted Jun 5, 2001·23 cites·10 claims
- 1655US7401642B2Heat sink with heat pipesHON HAI PREC IND CO LTD·Filed 2004·Granted Jul 22, 2008·6 cites·11 claims
- 1754US6459583B1Ready-to-mount heat dissipating assemblyHON HAI PREC IND CO LTD·Filed 2000·Granted Oct 1, 2002·6 cites·7 claims
- 1853US6118661AClip for retaining a heat sink on a chipFOXCONN PRECISION COMPONENTS C·Filed 1999·Granted Sep 12, 2000·18 cites·17 claims
- 1952US6452800B2Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socketHON HAI PREC IND CO LTD·Filed 2001·Granted Sep 17, 2002·5 cites·7 claims
- 2051US6360812B1Heat dissipating assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 2000·Granted Mar 26, 2002·4 cites·8 claims
- 2147US6665934B2Method for making heat dissipation deviceFOXCONN PREC COMPONENTS CO LTD·Filed 2002·Granted Dec 23, 2003·2 cites·9 claims
- 2237US2004134642A1Heat dissipation device including heat sink and heat pipesFiled 2003·Application pending·0 cites
- 2333US6272014B1Heat sink device for a chipFOXCONN PRECISON COMPONENTS CO·Filed 1999·Granted Aug 7, 2001·7 cites·13 claims
- 2431US6317323B1Heat sink assembly for an electrical socketFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted Nov 13, 2001·5 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →