Heat dissipation device including heat sink and heat pipes

Abstract

A heat dissipation device includes a heat sink ( 10 ) and a pair of heat pipes ( 20 ). The heat sink includes a base ( 12 ), a top plate ( 18 ), and a plurality of fins ( 16 ) thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.

What is claimed is:  
     
         1 . A heat dissipation device comprising: 
 a heat sink comprising a base and a plate spaced apart from the base, a plurality of fins soldered to the base and the plate at opposite ends thereof; and    a plurality of heat pipes thermally connecting the base and the plate.    
     
     
         2 . The heat dissipation device of  claim 1 , wherein ports are defined in the base and the plate respectively, the ports receiving opposite ends of the heat pipes.  
     
     
         3 . The heat dissipation device of  claim 1 , wherein the ports are holes.  
     
     
         4 . The heat dissipation device of  claim 1 , wherein the ports are cutouts.  
     
     
         5 . The hat dissipation device of  claim 1 , wherein the opposite ends of the fins are right angled and abut against the neighboring fins for not only providing sufficient area for soldering to both said base and plate, but also mutually enhancing rigidity of the neighboring fins.  
     
     
         6 . A heat dissipation device comprising: 
 a heat sink comprising a base, a plate spaced apart from the base, and a plurality of fins thermally connecting the base and the plate through solder; and    a plurality of heat pipes engaged between the base and the plate, for transferring heat from the base to the plate.    
     
     
         7 . The heat dissipation device of  claim 6 , wherein the solder is tin.  
     
     
         8 . The hat dissipation device of  claim 6 , wherein at least one of the opposite ends of the fin is right angled and abuts against the neighboring fins, which not only provides sufficient area for soldering to the corresponding plate or base, but also mutually enhances rigidity of the neighboring fins.  
     
     
         9 . A heat dissipation device comprising: 
 a heat sink comprising a base, a plate spaced apart from the base, and a plurality of fins located between said base and said plate and thermally respectively connecting to at least one of the base and the plate through solder; and    a plurality of heat pipes engaged between the base and the plate, for transferring heat from the base to the plate.    
     
     
         10 . The hat dissipation device of  claim 9 , wherein at least one of the opposite ends of each of the fins is right angled and abuts against the neighboring fins, which not only provides sufficient area for soldering to the corresponding plate or base connected thereto, but also mutually enhances rigidity of the neighboring fins.