Inventor · disambiguated record
Werner Pamler
Also filed as: PAMLER WERNER
12 granted patents·2 pending applications·99 citations·filing 1995–2011
90Inventor score
Top patents by PatentIndex Score
14 records- 0187US7807563B2Method for manufacturing a layer arrangement and layer arrangementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 5, 2010·23 cites·18 claims
- 0277US7422940B2Layer arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 9, 2008·8 cites·9 claims
- 0375US7033926B2Strip conductor arrangement and method for producing a strip conductor arrangementINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 25, 2006·24 cites·27 claims
- 0473US7755160B2Plasma excited chemical vapor deposition method silicon/oxygen/nitrogen-containing-material and layered assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 13, 2010·4 cites·17 claims
- 0568US8877631B2Interconnect arrangement and associated production methodsENGELHARDT MANFRED·Filed 2011·Granted Nov 4, 2014·2 cites·10 claims
- 0668US7023063B2Arrangement of microstructuresINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 4, 2006·12 cites·8 claims
- 0761US6737692B2Method for fabricating a component, and component having a metal layer and an insulation layerINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 18, 2004·7 cites·5 claims
- 0855US6686643B2Substrate with at least two metal structures deposited thereon, and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 3, 2004·7 cites·6 claims
- 0953US7045070B1Method of producing an electrode configuration and method of electrically contacting the electrode configurationINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 16, 2006·4 cites·16 claims
- 1052US6825098B2Method for fabricating microstructures and arrangement of microstructuresINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 30, 2004·4 cites·16 claims
- 1146US2006199368A1Interconnect arrangement and associated production methodsENGELHARDT MANFRED·Filed 2006·Application pending·0 cites
- 1243US7259441B2Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 21, 2007·1 cites·9 claims
- 1340US2007120263A1Conductor track arrangement and associated production methodGABRIC ZVONIMIR·Filed 2006·Application pending·0 cites
- 1432US5626279AMethod for fastening a first substrate on a second substrate and employment of said method for manufacturing a three-dimensional circuit arrangementSIEMENS AG·Filed 1995·Granted May 6, 1997·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →