Inventor · disambiguated record
Wei Qin
Also filed as: QIN WEI · QIN WEI IVY
14 granted patents·15 pending applications·33 citations·filing 1996–2025
88Inventor score
Files withKULICKE & SOFFA IND INC23QIN WEI3KLA CORP1KULICKE & SOFFA INVESTMENTS1SHANGHAI HUALI MICROELECT CORP1
Top patents by PatentIndex Score
29 records- 0191US11597031B2Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2021·Granted Mar 7, 2023·2 cites·34 claims
- 0283US12183711B2Methods of determining a sequence for creating a plurality of wire loops in connection with a workpieceKULICKE & SOFFA IND INC·Filed 2023·Granted Dec 31, 2024·1 cites·28 claims
- 0374US8302840B2Closed loop wire bonding methods and bonding force calibrationQIN WEI·Filed 2007·Granted Nov 6, 2012·9 cites·26 claims
- 0471US11865633B2Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Granted Jan 9, 2024·0 cites·13 claims
- 0571US10672735B2Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loopsKULICKE & SOFFA IND INC·Filed 2019·Granted Jun 2, 2020·1 cites·27 claims
- 0671US2024404986A1Methods of calibrating an ultrasonic characteristic on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 0768US11935864B2Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Mar 19, 2024·0 cites·11 claims
- 0868US2025079396A1Methods of determining a sequence for creating a plurality of wire loops in connection with a workpieceKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 0967US12113043B2Methods of calibrating an ultrasonic characteristic on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2022·Granted Oct 8, 2024·0 cites·22 claims
- 1067US10325878B2Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loopsKULICKE & SOFFA IND INC·Filed 2017·Granted Jun 18, 2019·1 cites·21 claims
- 1166US10665564B2On-bonder automatic overhang die optimization tool for wire bonding and related methodsKULICKE & SOFFA IND INC·Filed 2018·Granted May 26, 2020·0 cites·20 claims
- 1264US11289448B2Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loopsKULICKE & SOFFA IND INC·Filed 2020·Granted Mar 29, 2022·0 cites·23 claims
- 1363US10121759B2On-bonder automatic overhang die optimization tool for wire bonding and related methodsKULICKE & SOFFA IND INC·Filed 2016·Granted Nov 6, 2018·1 cites·11 claims
- 1463US2025277877A1Methods of testing a process window, and automatically optimizing a process, on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2025·Application pending·0 cites
- 1562US11515285B2Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2021·Granted Nov 29, 2022·0 cites·14 claims
- 1661US2025162093A1Wire bonding systems, wire bonding tool replacement systems, and related methodsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1761US2025022122A1Methods of detecting a crack in a semiconductor element, and related wire bonding systemsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1861US2025173880A1System and method for in-situ swath positioningKLA CORP·Filed 2024·Application pending·0 cites
- 1952US2023352443A1Methods of improving wire bonding operationsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 2050US7735716B2Method of controlling the trajectory of a bonding tool during the formation of a wire loopKULICKE & SOFFA IND INC·Filed 2007·Granted Jun 15, 2010·1 cites·25 claims
- 2149US5884834AMulti-frequency ultrasonic wire bonder and methodKULICKE & SOFFA INVESTMENTS·Filed 1996·Granted Mar 23, 1999·17 cites·15 claims
- 2249US2023325552A1Methods of determining suitability of a wire bonding tool for a wire bonding application, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 2349US2023325578A1Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 2447US2022270937A1Methods of determining shear strength of bonded free air balls on wire bonding machinesKULICKE & SOFFA IND INC·Filed 2022·Application pending·0 cites
- 2546US2009308904A1Wire feed system and method of operating the sameKULICKE & SOFFA IND INC·Filed 2006·Application pending·0 cites
- 2645US2012160902A1Wire feed system and method of operating the sameQIN WEI·Filed 2012·Application pending·0 cites
- 2741US2010186991A1conductive bumps, wire loops including the improved conductive bumps, and methods of forming the sameKULICKE & SOFFA IND INC·Filed 2006·Application pending·0 cites
- 2838US2012074206A1Methods of forming wire bonds for wire loops and conductive bumpsQIN WEI·Filed 2011·Application pending·0 cites
- 2938US2014349464A1Method for forming dual sti structureSHANGHAI HUALI MICROELECT CORP·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wei Qin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →