Inventor · disambiguated record
Werner Reiss
Also filed as: REISS WERNER · REISS WERNER JOSEF
10 granted patents·6 pending applications·176 citations·filing 1991–2020
87Inventor score
Top patents by PatentIndex Score
16 records- 0198US9935065B1Radio frequency device packages and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 3, 2018·121 cites·28 claims
- 0296US10505255B2Radio frequency device packages and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 10, 2019·24 cites·20 claims
- 0383US7265441B2Stackable single package and stacked multi-chip assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 4, 2007·13 cites·20 claims
- 0472US11450642B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 0571US10615145B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 7, 2020·0 cites·10 claims
- 0670US10896893B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 19, 2021·0 cites·20 claims
- 0769US10892247B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 12, 2021·0 cites·20 claims
- 0868US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0962US5232891AProcess for the manufacture of a gauze for a catalytic converter and a gauze for a catalytic converter manufactured according theretoHERAEUS GMBH W C·Filed 1991·Granted Aug 3, 1993·16 cites·13 claims
- 1056US2011079242A1Plasma cleaning of wire strandsREISS WERNER·Filed 2009·Application pending·0 cites
- 1146US2011162204A1Integrated deviceQIMONDA AG·Filed 2011·Application pending·0 cites
- 1246US2008064232A1Integrated deviceQIMONDA AG·Filed 2007·Application pending·0 cites
- 1340US2020185293A1Semiconductor Package Having a Laser-Activatable Mold CompoundINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1438US2007090527A1Integrated chip device in a packageTHOMAS JOCHEN·Filed 2005·Application pending·0 cites
- 1537US8592258B2Semiconductor package and method of attaching semiconductor dies to substratesCASTILLO DENVER PAUL C·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 1637US2009194871A1Semiconductor package and method of attaching semiconductor dies to substratesUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →