Inventor · disambiguated record
Wei-Shuo Su
Also filed as: SU WEI · SU WEI-SHUO
13 granted patents·8 pending applications·5 citations·filing 2013–2023
83Inventor score
Files withMICRON OPTOELECTRONICS CO LTD6TAIWAN SEMICONDUCTOR MFG CO LTD6ZHEN DING TECHNOLOGY CO LTD3FUKUI PREC COMPONENT (SHENZHEN) CO LTD2AVARY HOLDING SHENZHEN CO LTD1
Top patents by PatentIndex Score
21 records- 0182US11079685B2Method of manufacturing photo masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 3, 2021·2 cites·20 claims
- 0273US2023205093A1Method of manufacturing photo masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0372US9905508B2Package structureQI DING TECH QINHUANGDAO CO LTD·Filed 2017·Granted Feb 27, 2018·2 cites·10 claims
- 0471US11592751B2Method of manufacturing photo masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 0558US9190386B2Substrate, chip package and method for manufacturing substrateZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Nov 17, 2015·1 cites·8 claims
- 0658US2023305381A1Euv photo masks and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0753US11543753B2Tunable illuminator for lithography systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 0853US2023142738A1Electrochromic material and preparation method thereof, electrochromic deviceMICRON OPTOELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0952US11914830B2Metal mesh structure, touch display device and mobile terminalMICRON OPTOELECTRONICS CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·10 claims
- 1052US9159614B2Packaging substrate and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·5 claims
- 1152US2017367191A1Printed circuit boardAVARY HOLDING (SHENZHEN) CO LTD·Filed 2017·Application pending·0 cites
- 1251US11201064B2Signal line patterning for standard cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·20 claims
- 1351US9788437B2Method for manufacturing printed circuit board with etching process to partially remove conductive layerFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Oct 10, 2017·0 cites·10 claims
- 1449US11755131B2Foldable touch screen electrode structure, touch screen and touch display deviceMICRON OPTOELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·10 claims
- 1549US2023217549A1Electrothermal film structure, electrothermal film heating device and method for manufacturing electrothermal filmMICRON OPTOELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1648US11966551B2Metal mesh touch screen and method for manufacturing metal mesh touch screenMICRON OPTOELECTRONICS CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·2 claims
- 1748US2015000959A1Multilayer printed circuit board having anisotropy condictive film and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1845US9472426B2Packaging substrate and method for manufacturing sameZHEN DING TECH CO LTD·Filed 2015·Granted Oct 18, 2016·0 cites·8 claims
- 1944US9786589B2Method for manufacturing package structureHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2015·Granted Oct 10, 2017·0 cites·8 claims
- 2039US2023147436A1Method for manufacturing metal sensing electrode structure, touch display device and mobile terminalMICRON OPTOELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2131US2017110427A1Chip package and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →