Inventor · disambiguated record
Wen-Sen Tang
Also filed as: TANG WEN · TANG WEN-SEN
2 granted patents·2 pending applications·25 citations·filing 2000–2023
54Inventor score
Files withMEDIATEK SINGAPORE PTE LTD1SILICONWARE PRECISION INDUSTRIES CO LTD1TANG WEN-SEN1UNIMICRON TECHNOLOGY CORP1
Top patents by PatentIndex Score
4 records- 0172US6396156B1Flip-chip bonding structure with stress-buffering property and method for making the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 28, 2002·25 cites·20 claims
- 0250US11715715B2Metal bump structure and manufacturing method thereof and driving substrateUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 1, 2023·0 cites·14 claims
- 0349US2023308220A1HANDLING HARQ FEEDBACK IN INTERNET OF THINGS (IoT)MEDIATEK SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0440US2006048065A1Event handling systemTANG WEN-SEN·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wen-Sen Tang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →