Inventor · disambiguated record
Wei Tang
Also filed as: TANG WEI · TANG WEI-SEN
10 granted patents·3 pending applications·977 citations·filing 2000–2024
91Inventor score
Files withLAM RES CORP9SILICONWARE PRECISION INDUSTRIES CO LTD2FIRST INT COMPUTER INC1KEYSIGHT TECHNOLOGIES INC1
Top patents by PatentIndex Score
13 records- 0198US9966299B2Inhibitor plasma mediated atomic layer deposition for seamless feature fillLAM RES CORP·Filed 2016·Granted May 8, 2018·365 cites·19 claims
- 0298US9425078B2Inhibitor plasma mediated atomic layer deposition for seamless feature fillLAM RES CORP·Filed 2015·Granted Aug 23, 2016·454 cites·22 claims
- 0394US6291264B1Flip-chip package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 18, 2001·88 cites·6 claims
- 0493US11049716B2Gap fill using carbon-based filmsLAM RES CORP·Filed 2018·Granted Jun 29, 2021·11 cites·13 claims
- 0590US6400036B1Flip-chip package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 4, 2002·53 cites·5 claims
- 0677US9406544B1Systems and methods for eliminating seams in atomic layer deposition of silicon dioxide film in gap fill applicationsLAM RES CORP·Filed 2015·Granted Aug 2, 2016·2 cites·16 claims
- 0769US9786496B2Method of densifying films in semiconductor deviceLAM RES CORP·Filed 2015·Granted Oct 10, 2017·1 cites·16 claims
- 0858US9966255B2Method of densifying films in semiconductor deviceLAM RES CORP·Filed 2017·Granted May 8, 2018·0 cites·8 claims
- 0954US12513038B1Determining frequency offset of signal under testKEYSIGHT TECHNOLOGIES INC·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 1054US2018308690A1Densifying films in semiconductor deviceLAM RES CORP·Filed 2018·Application pending·0 cites
- 1150US7375736B2Test method for VGA with overclock frequency and a VGA system thereofFIRST INT COMPUTER INC·Filed 2004·Granted May 20, 2008·3 cites·16 claims
- 1243US2016314964A1Gap fill using carbon-based filmsLAM RES CORP·Filed 2015·Application pending·0 cites
- 1335US2016329213A1Highly selective deposition of amorphous carbon as a metal diffusion barrier layerLAM RES CORP·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wei Tang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →