Inventor · disambiguated record
Wei-Chuan Tsai
Also filed as: TSAI WEI-CHUAN
23 granted patents·11 pending applications·44 citations·filing 2009–2025
93Inventor score
Top patents by PatentIndex Score
34 records- 0195US11968906B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 23, 2024·5 cites·8 claims
- 0290US10199269B2Conductive structure and method for manufacturing conductive structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·6 cites·10 claims
- 0389US9640482B1Semiconductor device with a contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 2, 2017·6 cites·20 claims
- 0488US2025344612A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0586US10756128B2Integrated circuit device and method of fabricating integrated circuitUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·5 cites·20 claims
- 0686US10134629B1Method for manufacturing a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 20, 2018·4 cites·11 claims
- 0786US9887158B1Conductive structure having an entrenched high resistive layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·5 cites·11 claims
- 0884US12389807B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Aug 12, 2025·0 cites·9 claims
- 0984US12279536B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 15, 2025·0 cites·6 claims
- 1082US9853123B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 26, 2017·4 cites·28 claims
- 1179US2025212696A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1277US10497607B2Manufacturing method of interconnect structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 3, 2019·2 cites·20 claims
- 1377US9755047B2Semiconductor process and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·2 cites·3 claims
- 1476US9735015B1Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·2 cites·19 claims
- 1573US2024397832A1Magnetic random access memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1673US2025081568A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1769US7741496B2Ascorbic acid derivativesCORUM INC·Filed 2009·Granted Jun 22, 2010·2 cites·6 claims
- 1868US12089504B2Magnetic random access memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 10, 2024·0 cites·10 claims
- 1966US12183801B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 31, 2024·0 cites·7 claims
- 2066US10867808B1Manufacturing method of connection structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 15, 2020·1 cites·19 claims
- 2160US12336245B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·12 claims
- 2260US2025349765A1Semiconductor structure including hybrid bond contact and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2360US2025385183A1Conductive structure of copper and aluminum and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2458US10497617B2Conductive structure and method for manufacturing conductive structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 3, 2019·0 cites·9 claims
- 2558US2025089448A1Organic light-emitting diode display deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2657US2025248103A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2756US12426515B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 23, 2025·0 cites·11 claims
- 2853US10192826B2Conductive layout structure including high resistive layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 2953US9985110B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·0 cites·9 claims
- 3045US11450564B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 20, 2022·0 cites·7 claims
- 3145US8053474B2Compound with carboxyl acid group and amide group and application thereofCORUM INC·Filed 2009·Granted Nov 8, 2011·0 cites·19 claims
- 3245US2022122915A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 3338US2020006517A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3436US2018366368A1Method for forming contact structureUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →