Inventor · disambiguated record
Wei-Tsu Tseng
Also filed as: TSENG WEI-TSU
24 granted patents·9 pending applications·492 citations·filing 1997–2023
96Inventor score
Top patents by PatentIndex Score
33 records- 0196US7190079B2Selective capping of copper wiringIBM·Filed 2005·Granted Mar 13, 2007·39 cites·9 claims
- 0296US7008871B2Selective capping of copper wiringIBM·Filed 2003·Granted Mar 7, 2006·105 cites·23 claims
- 0395US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0492US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 0592US5922091AChemical mechanical polishing slurry for metallic thin filmNAT SCIENCE COUNCIL REPUBLIC CHINA·Filed 1997·Granted Jul 13, 1999·89 cites·14 claims
- 0685US10340183B1Cobalt plated via integration schemeGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 2, 2019·4 cites·13 claims
- 0784US8324622B2Method of repairing probe padsZHANG JOHN H·Filed 2009·Granted Dec 4, 2012·9 cites·12 claims
- 0884US7407879B2Chemical planarization performance for copper/low-k interconnect structuresIBM·Filed 2006·Granted Aug 5, 2008·10 cites·19 claims
- 0982US6660820B1Low dielectric constant polymer and monomers used in their formationIBM·Filed 2002·Granted Dec 9, 2003·21 cites·17 claims
- 1081US8822994B2Method of repairing probe padsZHANG JOHN H·Filed 2012·Granted Sep 2, 2014·4 cites·15 claims
- 1181US7510463B2Extended life conditioning diskIBM·Filed 2006·Granted Mar 31, 2009·11 cites·11 claims
- 1276US9607864B2Dual medium filter for ion and particle filtering during semiconductor processingZHANG JOHN H·Filed 2012·Granted Mar 28, 2017·3 cites·18 claims
- 1371US10109505B2Dual medium filter for ion and particle filtering during semiconductor processingIBM·Filed 2017·Granted Oct 23, 2018·1 cites·8 claims
- 1471US8920567B2Post metal chemical-mechanical planarization cleaning processIBM·Filed 2013·Granted Dec 30, 2014·3 cites·20 claims
- 1571US7253098B2Maintaining uniform CMP hard mask thicknessIBM·Filed 2004·Granted Aug 7, 2007·13 cites·7 claims
- 1666US9633946B1Seamless metallization contactsGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 25, 2017·1 cites·20 claims
- 1762US7071539B2Chemical planarization performance for copper/low-k interconnect structuresIBM·Filed 2003·Granted Jul 4, 2006·8 cites·30 claims
- 1861US6165886AAdvanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effectWINBOND ELECTRONICS CORP·Filed 1998·Granted Dec 26, 2000·26 cites·9 claims
- 1958US2024431025A1Corrosion resistant single damascene interconnectsIBM·Filed 2023·Application pending·0 cites
- 2056US9059177B2Doping of copper wiring structures in back end of line processingIBM·Filed 2014·Granted Jun 16, 2015·0 cites·4 claims
- 2155US6235608B1STI process by method of in-situ multilayer dielectric depositionWINBOND ELECTRONICS CORP·Filed 1999·Granted May 22, 2001·19 cites·12 claims
- 2253US8765602B2Doping of copper wiring structures in back end of line processingDYER THOMAS W·Filed 2012·Granted Jul 1, 2014·0 cites·15 claims
- 2353US6441465B2Scribe line structure for preventing from damages thereof induced during fabricationWINBOND ELECTRONICS CORP·Filed 1999·Granted Aug 27, 2002·19 cites·4 claims
- 2450US2013072011A1Method of repairing probe padsZHANG JOHN H·Filed 2012·Application pending·0 cites
- 2548US2015255397A1Doping of copper wiring structures in back end of line processingIBM·Filed 2015·Application pending·0 cites
- 2647US9293365B2Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishingIBM·Filed 2014·Granted Mar 22, 2016·0 cites·20 claims
- 2745US2016071791A1Multimetal interlayer interconnectsGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 2843US7556972B2Detection and characterization of SiCOH-based dielectric materials during device fabricationIBM·Filed 2007·Granted Jul 7, 2009·0 cites·8 claims
- 2943US2014097539A1Technique for uniform cmpST MICROELECTRONICS INC·Filed 2013·Application pending·0 cites
- 3039US2006105676A1Robust Signal Processing Algorithm For End-Pointing Chemical-Mechanical Polishing ProcessesIBM·Filed 2004·Application pending·0 cites
- 3138US2004094511A1Method of forming planar Cu interconnects without chemical mechanical polishingIBM·Filed 2002·Application pending·0 cites
- 3237US2007190788A1Wafer removing force reduction on cmp toolBALACHANDRAN MANOJ·Filed 2006·Application pending·0 cites
- 3330US2001042903A1Inter-metal dielectric layer structure and its forming methodFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →