Inventor · disambiguated record
Weili Wang
Also filed as: WANG WEILI
20 granted patents·9 pending applications·160 citations·filing 2001–2023
93Inventor score
Files withSANDISK SEMICONDUCTOR SHANGHAI CO LTD5RADIO FREQUENCY SYSTEMS INC3CHIEN JACK CHANG2GOMTSYAN ARTHUR R2RADIO FREQUENCY SYSTEMS2
Top patents by PatentIndex Score
29 records- 0191US6853271B2Triple-mode mono-block filter assemblyRADIO FREQUENCY SYSTEMS INC·Filed 2001·Granted Feb 8, 2005·36 cites·27 claims
- 0290US7042314B2Dielectric mono-block triple-mode microwave delay filterRADIO FREQUENCY SYSTEMS·Filed 2002·Granted May 9, 2006·37 cites·9 claims
- 0390US6954122B2Hybrid triple-mode ceramic/metallic coaxial filter assemblyRADIO FREQUENCY SYSTEMS INC·Filed 2003·Granted Oct 11, 2005·30 cites·12 claims
- 0487US7068127B2Tunable triple-mode mono-block filter assemblyRADIO FREQUENCY SYSTEMS·Filed 2001·Granted Jun 27, 2006·29 cites·6 claims
- 0584US10553737B2Photovoltaic assemblySUNMAN HONG KONG LTD·Filed 2019·Granted Feb 4, 2020·4 cites·20 claims
- 0683US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0776US8232309B2Prodrugs of compounds that inhibit TRPV1 receptorGOMTSYAN ARTHUR R·Filed 2006·Granted Jul 31, 2012·2 cites·22 claims
- 0875US10418334B2Semiconductor device including corner recessSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·16 claims
- 0973US8499813B2System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2012·Granted Aug 6, 2013·6 cites·20 claims
- 1058US7327210B2Band agile filterRADIO FREQUENCY SYSTEMS INC·Filed 2004·Granted Feb 5, 2008·6 cites·56 claims
- 1158US2024169270A1Model training method and apparatus, electronic device and storage mediumDOUYIN VISION CO LTD·Filed 2023·Application pending·0 cites
- 1255US12463097B2Semiconductor device with reduced stress die pick and placeSANDISK TECHNOLOGIES INC·Filed 2021·Granted Nov 4, 2025·0 cites·12 claims
- 1352US10316335B2Methods and compositions for generating stable transfected cellsMAXCYTE INC·Filed 2014·Granted Jun 11, 2019·0 cites·14 claims
- 1451US11749647B2Semiconductor device including vertical wire bondsWESTERN DIGITAL TECH INC·Filed 2020·Granted Sep 5, 2023·0 cites·18 claims
- 1548US2012277190A1Prodrugs of compounds that inhibit trpv1 receptorGOMTSYAN ARTHUR R·Filed 2012·Application pending·0 cites
- 1648US2015155247A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2014·Application pending·0 cites
- 1747US2017179101A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2017·Application pending·0 cites
- 1846US9462694B2Spacer layer for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2014·Granted Oct 4, 2016·0 cites·22 claims
- 1943US8346301B2Calling method, device, and systemHUAWEI TECH CO LTD·Filed 2009·Granted Jan 1, 2013·0 cites·8 claims
- 2042US10872989B2Encapsulant material for photovoltaic modules and method of preparing the sameTIGER NEW SURFACE MAT SUZHOU CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·7 claims
- 2138US2021252308A1Direct measurement of immune system radiosensitivity and radiotherapy treatment plan optimizationUNIV INDIANA RES & TECH CORP·Filed 2019·Application pending·0 cites
- 2238US2019097071A1Encapsulant material for photovoltaic modules and method of preparing the sameTIGER NEW SURFACE MAT SUZHOU CO LTD·Filed 2018·Application pending·0 cites
- 2337US11007739B2Pressing machine and corresponding side plate unit structureSUZHOU JIANGNAN AEROSPACE MECH & ELECTRICAL INDUSTRY CO LTD·Filed 2017·Granted May 18, 2021·0 cites·10 claims
- 2436US2018284116A1Antigen polypeptide for detecting plasma immune marker-vegfr1 autoantibody and application thereofQINGDAO HAILANSHEN BIOTECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 2536US2015109221A1Method, device, and electronic terminal for unlockingWANG WEILI·Filed 2012·Application pending·0 cites
- 2633US2011084377A1System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2010·Application pending·0 cites
- 2731US10354022B2Visual efficacy determining method for non-coloured objects in different light environments and system thereofUNIV BEIJING TECHNOLOGY·Filed 2015·Granted Jul 16, 2019·0 cites·8 claims
- 2827US7434875B2Automobile ventilation seat and back cushionWANG WEILI·Filed 2006·Granted Oct 14, 2008·0 cites·10 claims
- 2925US10452929B2Illumination standard calculation method and system for a tunnel entrance section in daytime based on safe visual recognitionBEIJING UNIV OF TECHNOLOGY CN·Filed 2015·Granted Oct 22, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →