Inventor · disambiguated record
Wen-Kuei Wu
Also filed as: WU WEN-KUEI
12 granted patents·13 pending applications·33 citations·filing 2006–2015
87Inventor score
Top patents by PatentIndex Score
25 records- 0178US7834365B2LED chip package structure with high-efficiency light-emitting effect and method of packing the sameHARVATEK CORP·Filed 2007·Granted Nov 16, 2010·7 cites·11 claims
- 0270US8017969B2LED chip package structure with high-efficiency light emission by rough surfaces and method of making the sameHARVATEK CORP·Filed 2008·Granted Sep 13, 2011·4 cites·12 claims
- 0368US8002436B2LED chip package structure using a substrate as a lampshade and method for making the sameHARVATEK CORPORTION·Filed 2008·Granted Aug 23, 2011·6 cites·6 claims
- 0464US8138508B2LED chip package structure with different LED spacings and a method for making the sameWANG BILY·Filed 2008·Granted Mar 20, 2012·5 cites·22 claims
- 0562US8198800B2LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the sameWANG BILY·Filed 2008·Granted Jun 12, 2012·2 cites·3 claims
- 0659US7951621B2LED chip package structure with high-efficiency light-emitting effect and method of packaging the sameHARVATEK CORP·Filed 2009·Granted May 31, 2011·1 cites·21 claims
- 0758US7829901B2LED chip package structure with high-efficiency light-emitting effect and method for making the sameHARVATEK CORP·Filed 2008·Granted Nov 9, 2010·2 cites·14 claims
- 0857US7923745B2LED chip package structure with high-efficiency light-emitting effect and method of packaging the sameHARVATEK CORP·Filed 2007·Granted Apr 12, 2011·1 cites·10 claims
- 0952US2009246897A1LED chip package structure and method for manufacturing the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1050US2009224265A1LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the sameWANG BILY·Filed 2008·Application pending·0 cites
- 1149US8162510B2LED chip package structure with multifunctional integrated chips and a method for making the sameWANG BILY·Filed 2008·Granted Apr 24, 2012·0 cites·2 claims
- 1249US2009224266A1LED chip package structure applied to a backlight module and method for making the sameWANG BILY·Filed 2008·Application pending·0 cites
- 1347US2008012035A1LED chip package structure and method for manufacturing the sameWANG BILY·Filed 2006·Application pending·0 cites
- 1446US2011189803A1Led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the sameHARVATEK CORP·Filed 2011·Application pending·0 cites
- 1546US2012049212A1Led chip package structure with a high-efficiency heat-dissipating substrate and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1645US8183065B2LED chip package structure with high-efficiency light emission by rough surfaces and method of making the sameWANG BILY·Filed 2010·Granted May 22, 2012·0 cites·26 claims
- 1745USD660259SStrip LEDWANG BILY·Filed 2011·Granted May 22, 2012·5 cites·1 claims
- 1844US7815346B2Method for calculating out an optimum arrangement pitch between each two LED chip package unitsHARVATEK CORP·Filed 2008·Granted Oct 19, 2010·0 cites·7 claims
- 1939US2012009700A1Method of manufacturing a led chip package structureWANG BILY·Filed 2011·Application pending·0 cites
- 2039US2012001203A1Led chip package structureWANG BILY·Filed 2011·Application pending·0 cites
- 2135US2017051853A1Pipe Joint StructureWU WEN-KUEI·Filed 2015·Application pending·0 cites
- 2234US2011156061A1Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofHARVATEK CORP·Filed 2010·Application pending·0 cites
- 2334US2011156083A1Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofHARVATEK CORP·Filed 2010·Application pending·0 cites
- 2434US2011156060A1Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofHARVATEK CORP·Filed 2010·Application pending·0 cites
- 2534US2011157868A1Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereofHARVATEK CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →