Led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same

Abstract

An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.

1 . A method for making an LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature, comprising:
 providing a substrate unit;   electrically arranging a plurality of LED chips on the substrate unit via a matrix method to form a plurality of longitudinal LED chip rows;   longitudinally and respectively covering the longitudinal LED chip rows with a plurality of elongated transparent colloid bodies; and   longitudinally and respectively covering the whole elongated transparent colloid bodies with a plurality of elongated fluorescent colloid bodies.   
     
     
         2 . The method as claimed in  claim 1 , wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate. 
     
     
         3 . The method as claimed in  claim 1 , wherein the substrate unit has a substrate body, and a positive trace and a negative trace respectively formed on the substrate body, and the substrate body has a metal layer and a Bakelite layer formed on the metal layer. 
     
     
         4 . The method as claimed in  claim 3 , wherein each LED chip has a positive side and a negative side respectively and electrically connected with the positive trace and the negative trace of the substrate unit, and both the positive trace and the negative trace are aluminum circuits or silver circuits. 
     
     
         5 . The method as claimed in  claim 1 , wherein the elongated transparent colloid bodies are formed by a first mold unit, the first mold unit is composed of a first upper mold and a first lower mold for supporting the substrate unit, the first upper mold has a plurality of first channels corresponding to the longitudinal LED chip rows, and the height and the width of each first channel are equal to the height and the width of each elongated transparent colloid body. 
     
     
         6 . The method as claimed in  claim 1 , wherein the elongated fluorescent colloid bodies are formed by a second mold unit, the second mold unit is composed of a second upper mold and a second lower mold for supporting the substrate unit, the second upper mold has a plurality of second channels corresponding to the elongated transparent colloid bodies, and the height and the width of each second channel are equal to the height and the width of each elongated fluorescent colloid body. 
     
     
         7 . The method as claimed in  claim 1 , wherein each elongated fluorescent colloid body is formed by mixing silicon and fluorescent powders or by mixing epoxy and fluorescent powders. 
     
     
         8 . The method as claimed in  claim 1 , further comprising: transversely cutting the elongated transparent colloid bodies, the elongated fluorescent colloid bodies and the substrate unit along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a plurality of transparent colloid bodies that are separated from each other and respectively covering the LED chips and a plurality of fluorescent colloid bodies that are separated from each other and respectively covering the transparent colloid bodies. 
     
     
         9 . A method for making an LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature, comprising:
 providing a substrate unit;   electrically arranging a plurality of LED chips on the substrate unit via a matrix method to form a plurality of longitudinal LED chip rows;   longitudinally and respectively covering the longitudinal LED chip rows with a plurality of elongated transparent colloid bodies;   longitudinally and respectively covering the top surfaces of the elongated transparent colloid bodies with a plurality of elongated fluorescent colloid bodies; and   transversely cutting the elongated transparent colloid bodies and the elongated fluorescent colloid bodies along a line between each two adjacent and longitudinal LED chips to form a plurality of transparent colloid bodies that are separated from each other and respectively covering the LED chips and a plurality of fluorescent colloid bodies that are separated from each other and respectively covering the transparent colloid bodies.   
     
     
         10 . The method as claimed in  claim 9 , further comprising:
 covering the substrate unit with a frame unit via a third mold unit, wherein the frame unit is formed around the peripheries of each transparent colloid body and each fluorescent colloid body; and   transversely cutting the frame unit and the substrate unit along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a frame layer covering the peripheries of each transparent colloid body and each fluorescent colloid body.   
     
     
         11 . The method as claimed in  claim 10 , wherein the third mold unit is composed of a third upper mold and a third lower mold for supporting the substrate unit, the third upper mold has a third channel corresponding to the frame unit, the height of the third channel is equal to the distance from the top side of the substrate unit to the top side of the fluorescent colloid body, the width of the third channel is equal to the width of the frame unit. 
     
     
         12 . The method as claimed in  claim 10 , wherein the frame layer is an opaque frame layer, and the opaque frame layer is a white frame layer. 
     
     
         13 . The method as claimed in  claim 9 , further comprising:
 covering the substrate unit with a plurality of elongated frame layers via a fourth mold unit, wherein each elongated frame layers are longitudinally formed around the peripheries of each transparent colloid body and each fluorescent colloid body; and   transversely cutting the elongated frame layer and the substrate unit along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a plurality of frame bodies each covering the peripheries of each transparent colloid body and each fluorescent colloid body.   
     
     
         14 . The method as claimed in  claim 13 , wherein the fourth mold unit is composed of a fourth upper mold and a fourth lower mold for supporting the substrate unit, the fourth upper mold has a plurality of fourth channels corresponding to the longitudinal LED chip rows, the height of the fourth channel is equal to the distance from the top side of the substrate unit to the top side of the fluorescent colloid body, the width of the fourth channels is larger than the width of each transparent colloid body or each fluorescent colloid body. 
     
     
         15 . The method as claimed in  claim 13 , wherein each frame body is an opaque frame body, and the opaque frame body is a white frame body. 
     
     
         16 . The method as claimed in  claim 9 , wherein the top surface of each transparent colloid body is a cambered colloid surface and the front surface of each transparent colloid body has a light-outputting colloid surface formed in front of its cambered colloid surface, and the fluorescent colloid bodies are respectively covering the light-outputting colloid surfaces of the transparent colloid bodies. 
     
     
         17 . The method as claimed in  claim 16 , further comprising: forming a plurality of frame bodies each formed on the cambered colloid surface of each transparent colloid body.