Inventor · disambiguated record
Shih-Yu Wu
Also filed as: WU SHIH-YU
13 granted patents·13 pending applications·52 citations·filing 2003–2019
89Inventor score
Top patents by PatentIndex Score
26 records- 0178US7614766B2Modular illumination device with adjustable lighting anglesHARVATEK CORP·Filed 2006·Granted Nov 10, 2009·17 cites·14 claims
- 0275US7828464B2LED lamp structure and system with high-efficiency heat-dissipating functionHARVATEK CORP·Filed 2007·Granted Nov 9, 2010·11 cites·26 claims
- 0370US8017969B2LED chip package structure with high-efficiency light emission by rough surfaces and method of making the sameHARVATEK CORP·Filed 2008·Granted Sep 13, 2011·4 cites·12 claims
- 0468US8002436B2LED chip package structure using a substrate as a lampshade and method for making the sameHARVATEK CORPORTION·Filed 2008·Granted Aug 23, 2011·6 cites·6 claims
- 0567US7485480B2Method of manufacturing high power light-emitting device package and structure thereofHARVATEK CORP·Filed 2006·Granted Feb 3, 2009·3 cites·10 claims
- 0665US8623680B2LED chip package structure using sedimentation and method for making the sameWANG BILY·Filed 2011·Granted Jan 7, 2014·2 cites·12 claims
- 0764US8138508B2LED chip package structure with different LED spacings and a method for making the sameWANG BILY·Filed 2008·Granted Mar 20, 2012·5 cites·22 claims
- 0862US8198800B2LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the sameWANG BILY·Filed 2008·Granted Jun 12, 2012·2 cites·3 claims
- 0958US7829901B2LED chip package structure with high-efficiency light-emitting effect and method for making the sameHARVATEK CORP·Filed 2008·Granted Nov 9, 2010·2 cites·14 claims
- 1051US2009014745A1Method of manufacturing high power light-emitting device package and structure thereofWANG BILY·Filed 2008·Application pending·0 cites
- 1150US10971677B2Electrically controlled nanomagnet and spin orbit torque magnetic random access memory including the sameACADEMIA SINICA·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 1250US2009224265A1LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the sameWANG BILY·Filed 2008·Application pending·0 cites
- 1349US8162510B2LED chip package structure with multifunctional integrated chips and a method for making the sameWANG BILY·Filed 2008·Granted Apr 24, 2012·0 cites·2 claims
- 1449US2009224266A1LED chip package structure applied to a backlight module and method for making the sameWANG BILY·Filed 2008·Application pending·0 cites
- 1548US2010006880A1Led chip package structure using sedimentation and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1646US2007297177A1Modular lamp structureWANG BILY·Filed 2006·Application pending·0 cites
- 1746US2011189803A1Led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the sameHARVATEK CORP·Filed 2011·Application pending·0 cites
- 1846US2012049212A1Led chip package structure with a high-efficiency heat-dissipating substrate and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1946US2007133209A1Electrical lamp apparatusHARVATEK CORP·Filed 2005·Application pending·0 cites
- 2045US8183065B2LED chip package structure with high-efficiency light emission by rough surfaces and method of making the sameWANG BILY·Filed 2010·Granted May 22, 2012·0 cites·26 claims
- 2144US7815346B2Method for calculating out an optimum arrangement pitch between each two LED chip package unitsHARVATEK CORP·Filed 2008·Granted Oct 19, 2010·0 cites·7 claims
- 2242US2006252173A1Method for manufacturing photoelectric package having control chipWANG BILY·Filed 2006·Application pending·0 cites
- 2342US2006249656A1Manufacturing method for photoelectric package structure having two-layered substrate and control chipWANG BILY·Filed 2006·Application pending·0 cites
- 2441US2006071328A1Semiconductor substrate structureHARVATEK CORP·Filed 2005·Application pending·0 cites
- 2538US2005135113A1Optical projection device of a colored lighting moduleHARVATEK CORP·Filed 2003·Application pending·0 cites
- 2633US2006086945A1Package structure for optical-electrical semiconductorHARVATEK CORP·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shih-Yu Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →