Inventor · disambiguated record
Wenbing Yang
Also filed as: YANG WENBING
29 granted patents·14 pending applications·480 citations·filing 2003–2025
97Inventor score
Top patents by PatentIndex Score
43 records- 0198US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 0298US9805941B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2017·Granted Oct 31, 2017·44 cites·26 claims
- 0398US9806252B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2015·Granted Oct 31, 2017·61 cites·20 claims
- 0498US9576811B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2015·Granted Feb 21, 2017·65 cites·26 claims
- 0598US9257638B2Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Feb 9, 2016·55 cites·18 claims
- 0697US12105422B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2020·Granted Oct 1, 2024·13 cites·12 claims
- 0797US10374144B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2017·Granted Aug 6, 2019·21 cites·16 claims
- 0897US10186426B2Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2017·Granted Jan 22, 2019·16 cites·21 claims
- 0997US10096487B2Atomic layer etching of tungsten and other metalsLAM RES CORP·Filed 2016·Granted Oct 9, 2018·24 cites·16 claims
- 1097US9972504B2Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2015·Granted May 15, 2018·21 cites·19 claims
- 1197US9130158B1Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Sep 8, 2015·44 cites·19 claims
- 1296US10763083B2High energy atomic layer etchingLAM RES CORP·Filed 2018·Granted Sep 1, 2020·15 cites·22 claims
- 1396US10749103B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2019·Granted Aug 18, 2020·7 cites·10 claims
- 1495US12510825B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2024·Granted Dec 30, 2025·2 cites·33 claims
- 1595US12510826B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2024·Granted Dec 30, 2025·2 cites·12 claims
- 1695US10056264B2Atomic layer etching of GaN and other III-V materialsLAM RES CORP·Filed 2016·Granted Aug 21, 2018·20 cites·20 claims
- 1794US10515816B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2018·Granted Dec 24, 2019·6 cites·18 claims
- 1889US10727073B2Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfacesLAM RES CORP·Filed 2017·Granted Jul 28, 2020·5 cites·20 claims
- 1988US11935758B2Atomic layer etching for subtractive metal etchLAM RES CORP·Filed 2020·Granted Mar 19, 2024·2 cites·7 claims
- 2084US11450513B2Atomic layer etching and smoothing of refractory metals and other high surface binding energy materialsLAM RES CORP·Filed 2019·Granted Sep 20, 2022·3 cites·7 claims
- 2184US9391267B2Method to etch non-volatile metal materialsLAM RES CORP·Filed 2015·Granted Jul 12, 2016·3 cites·20 claims
- 2284US2025379042A1Method of cleaning chamber components with metal etch residuesLAM RES CORP·Filed 2025·Application pending·0 cites
- 2383US12080562B2Atomic layer etch and ion beam etch patterningLAM RES CORP·Filed 2020·Granted Sep 3, 2024·1 cites·16 claims
- 2481US12266542B2Atomic layer etching for subtractive metal etchLAM RES CORP·Filed 2024·Granted Apr 1, 2025·0 cites·9 claims
- 2581US2020161139A1Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2019·Application pending·0 cites
- 2679US7111203B2Method for implementing data backup and recovery in computer hard diskLEGEND BEIJING LTD·Filed 2003·Granted Sep 19, 2006·28 cites·10 claims
- 2777US2024274408A1High energy atomic layer etchingLAM RES CORP·Filed 2024·Application pending·0 cites
- 2874US2022115244A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 2972US2021305059A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 3072US2025191934A1Atomic layer etching for subtractive metal etchLAM RES CORP·Filed 2025·Application pending·0 cites
- 3171US12400842B2Method of cleaning chamber components with metal etch residuesLAM RES CORP·Filed 2021·Granted Aug 26, 2025·0 cites·11 claims
- 3266US12417902B2Method for cleaning a chamberLAM RES CORP·Filed 2021·Granted Sep 16, 2025·0 cites·22 claims
- 3366US2022392747A1Atomic layer etching and smoothing of refractory metals and other high surface binding energy materialsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3463US2020402770A1High energy atomic layer etchingLAM RES CORP·Filed 2020·Application pending·0 cites
- 3562US7447888B2Method for restoring computer operating systemLENOVO BEIJING LTD·Filed 2004·Granted Nov 4, 2008·15 cites·6 claims
- 3658US2018240682A1Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2018·Application pending·0 cites
- 3754US2025218774A1High energy atomic layer etch of a carbon containing layerLAM RES CORP·Filed 2023·Application pending·0 cites
- 3854US2025210363A1Fast atomic layer etchLAM RES CORP·Filed 2023·Application pending·0 cites
- 3950US2025243585A1Co-deposition and etch processLAM RES CORP·Filed 2023·Application pending·0 cites
- 4049US2024021435A1Metal etchLAM RES CORP·Filed 2021·Application pending·0 cites
- 4148US2023298869A1Subtractive copper etchLAM RES CORP·Filed 2021·Application pending·0 cites
- 4245US12256645B2Chemical etch nonvolatile materials for MRAM patterningLAM RES CORP·Filed 2020·Granted Mar 18, 2025·0 cites·23 claims
- 4336US9502600B2Inorganic solution and solution process for electronic and electro-optic devicesYANG YANG·Filed 2012·Granted Nov 22, 2016·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →