Inventor · disambiguated record
Weifeng Ye
Also filed as: YE WEIFENG
10 granted patents·16 pending applications·24 citations·filing 2008–2025
85Inventor score
Top patents by PatentIndex Score
26 records- 0187US10043709B2Methods for thermally forming a selective cobalt layerAPPLIED MATERIALS INC·Filed 2015·Granted Aug 7, 2018·5 cites·19 claims
- 0286US9105695B2Cobalt selectivity improvement in selective cobalt process sequenceAPPLIED MATERIALS INC·Filed 2014·Granted Aug 11, 2015·6 cites·20 claims
- 0378US10109520B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2016·Granted Oct 23, 2018·2 cites·14 claims
- 0478US9478460B2Cobalt selectivity improvement in selective cobalt process sequenceAPPLIED MATERIALS INC·Filed 2015·Granted Oct 25, 2016·2 cites·20 claims
- 0576US9580801B2Enhancing electrical property and UV compatibility of ultrathin blok barrier filmAPPLIED MATERIALS INC·Filed 2014·Granted Feb 28, 2017·3 cites·19 claims
- 0673US9633861B2Cu/barrier interface enhancementAPPLIED MATERIALS INC·Filed 2014·Granted Apr 25, 2017·3 cites·8 claims
- 0766US8758638B2Copper oxide removal techniquesYE WEIFENG·Filed 2011·Granted Jun 24, 2014·3 cites·24 claims
- 0865US2025372449A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0965US2025372448A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1065US2025372450A1Methods for forming low resistivity contactsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1164US2025376762A1Cyclic plasma and thermal process to improve pecvd ti silicide deposition selectivityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1261US2025379031A1Tuning deposition selectivityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1359US10707122B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2018·Granted Jul 7, 2020·0 cites·20 claims
- 1459US10546742B2Method to reduce trap-induced capacitance in interconnect dielectric barrier stackAPPLIED MATERIALS INC·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 1553US10170299B2Method to reduce trap-induced capacitance in interconnect dielectric barrier stackAPPLIED MATERIALS INC·Filed 2016·Granted Jan 1, 2019·0 cites·11 claims
- 1653US2025112091A1Surface treatment enabling super-conformal metal cap profile on middle of-line (mol) silicidesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1752US2025174456A1Thermal cvd of titanium silicide methods to form semiconductor structuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1851US2025054767A1Selective metal capping processes for a junction silicideAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1951US2009107626A1Adhesion improvement of dielectric barrier to copper by the addition of thin interface layerAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 2050US2025054812A1Selective bottom-up metal fill/cap on junction silicide by selective metal removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2150US2025079239A1Selective capping for gate-all-around field effect transistorsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2247US2012276301A1Adhesion improvement of dielectric barrier to copper by the addition of thin interface layerLEE YONG-WON·Filed 2012·Application pending·0 cites
- 2346US2023377892A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2444US2014273516A1Vbd and tddb improvement thru interface engineeringAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2543US2016013049A1Enhancing uv compatibility of low k barrier filmAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2637US2018144973A1Electromigration Improvement Using Tungsten For Selective Cobalt Deposition On Copper SurfacesAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →