Inventor · disambiguated record
Wen Yu
Also filed as: YU WEN · YU WEN-BIN
13 granted patents·5 pending applications·82 citations·filing 2002–2020
90Inventor score
Files withSPANSION LLC7ADVANCED MICRO DEVICES INC3MONTEREY RES LLC3CYPRESS SEMICONDUCTOR CORP1FANG SHENQING1
Top patents by PatentIndex Score
18 records- 0191US8039391B1Method of forming a contact in a semiconductor device with engineered plasma treatment profile of barrier metal layerSPANSION LLC·Filed 2006·Granted Oct 18, 2011·23 cites·5 claims
- 0286US7306988B1Memory cell and method of making the memory cellADVANCED MICRO DEVICES INC·Filed 2005·Granted Dec 11, 2007·18 cites·21 claims
- 0381US8669597B2Memory device interconnects and method of manufacturingFANG SHENQING·Filed 2008·Granted Mar 11, 2014·6 cites·19 claims
- 0474US7482217B1Forming metal-semiconductor films having different thicknesses within different regions of an electronic deviceSPANSION LLC·Filed 2007·Granted Jan 27, 2009·4 cites·20 claims
- 0572US7468296B1Thin film germanium diode with low reverse breakdownSPANSION LLC·Filed 2005·Granted Dec 23, 2008·4 cites·18 claims
- 0672US2021134715A1Memory Device Interconnects and Method of ManufactureMONTEREY RES LLC·Filed 2020·Application pending·0 cites
- 0767US7319065B1Semiconductor component and method of manufactureADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 15, 2008·16 cites·26 claims
- 0866US10833013B2Memory device interconnects and method of manufactureMONTEREY RES LLC·Filed 2019·Granted Nov 10, 2020·0 cites·13 claims
- 0962US10833009B2Memory device interconnects and method of manufactureMONTEREY RES LLC·Filed 2018·Granted Nov 10, 2020·0 cites·7 claims
- 1056US2014145337A1Memory Device Interconnects and Method of ManufactureSPANSION LLC·Filed 2013·Application pending·0 cites
- 1156US2014151887A1Memory Device Interconnects and Method of ManufactureSPANSION LLC·Filed 2013·Application pending·0 cites
- 1256US2017092577A1Memory Device Interconnects and Method of ManufactureCYPRESS SEMICONDUCTOR CORP·Filed 2016·Application pending·0 cites
- 1355US9299643B2Ruthenium interconnect with high aspect ratio and method of fabrication thereofWANG ZHENG·Filed 2008·Granted Mar 29, 2016·1 cites·6 claims
- 1455US6927162B1Method of forming a contact in a semiconductor device with formation of silicide prior to plasma treatmentADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 9, 2005·7 cites·19 claims
- 1553US7880221B2Forming metal-semiconductor films having different thicknesses within different regions of an electronic deviceSPANSION LLC·Filed 2008·Granted Feb 1, 2011·0 cites·20 claims
- 1646US7407882B1Semiconductor component having a contact structure and method of manufactureSPANSION LLC·Filed 2004·Granted Aug 5, 2008·3 cites·5 claims
- 1735US8236693B2Methods of forming silicides of different thicknesses on different structuresYU WEN·Filed 2007·Granted Aug 7, 2012·0 cites·15 claims
- 1824US2003119295A1Wafer and method of fabricating the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →