Inventor · disambiguated record
Wen-Fu Yu
Also filed as: YU WEN-FU
2 granted patents·6 pending applications·5 citations·filing 2005–2024
44Inventor score
Top patents by PatentIndex Score
8 records- 0173US7544621B2Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching methodUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jun 9, 2009·5 cites·14 claims
- 0254US2024204020A1Optical package structure and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0350US12256573B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0449US2024128291A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0549US2024337779A1Optical deviceTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0648US2025287724A1Optical deviceTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0747US2008286976A1Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching methodCHEN CHENG-KUEN·Filed 2008·Application pending·0 cites
- 0846US2024128139A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →