Inventor · disambiguated record
Wenbin Zhou
Also filed as: ZHOU WENBIN
41 granted patents·22 pending applications·110 citations·filing 2016–2025
97Inventor score
Files withYANGTZE MEMORY TECH CO LTD44HONEYWELL INT INC10KUNSHAN FANTAVIEW ELECTRONIC TECH CO LTD3HEWLETT PACKARD DEVELOPMENT CO LP1IMPERIAL COLLEGE INNOVATIONS LTD1
Top patents by PatentIndex Score
63 records- 0197US11963356B2Three-dimensional memory device without gate line slits and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 0293USD996988SBuilding controllerHONEYWELL INT INC·Filed 2022·Granted Aug 29, 2023·15 cites·1 claims
- 0393US11257831B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 0490USD985402SBuilding controllerHONEYWELL INT INC·Filed 2020·Granted May 9, 2023·14 cites·1 claims
- 0589US11251195B2Three-dimensional memory device without gate line slits and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Feb 15, 2022·4 cites·20 claims
- 0688US12052871B2Three-dimensional memory and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 30, 2024·1 cites·20 claims
- 0787US11211394B2Three-dimensional memory device with source structure and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Dec 28, 2021·3 cites·20 claims
- 0886US11271007B2Three-dimensional memory and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Mar 8, 2022·3 cites·17 claims
- 0986US10943916B2Method for manufacturing three-dimensional memory structureYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 9, 2021·4 cites·3 claims
- 1083US11043565B2Three-dimensional memory device with source contacts connected by an adhesion layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 22, 2021·4 cites·20 claims
- 1182US11114458B2Three-dimensional memory device with support structures in gate line slits and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
- 1282US2024324224A1Three-dimensional memory and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1380USD797744SImaging deviceHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Sep 19, 2017·21 cites·1 claims
- 1479US11183512B2Methods for forming three-dimensional memory device with support structure and resulting three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 23, 2021·2 cites·19 claims
- 1578US11094712B2Three-dimensional memory device with support structures in slit structures and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 1677US2023292511A1Three-dimensional memory device with support structures in gate line slits and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1774US11785772B2Three-dimensional memory device with source structure and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 1873US11765897B2Three-dimensional memory device without gate line slits and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 19, 2023·0 cites·13 claims
- 1973US11005083B2High-resolution Micro-OLED display module and manufacturing method thereofSUZHOU QINGYUE OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2019·Granted May 11, 2021·1 cites·17 claims
- 2072US11716850B2Three-dimensional memory device with support structures in gate line slits and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 2171US11653495B2Three-dimensional memory device with source structure and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted May 16, 2023·0 cites·9 claims
- 2271USD976222SMounting plate for a building controllerHONEYWELL INT INC·Filed 2020·Granted Jan 24, 2023·5 cites·1 claims
- 2369US12035523B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·7 claims
- 2468US2025331160A1Semiconductor device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2566US10756102B2Three-dimensional memory structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·9 claims
- 2666US2025386508A1Semiconductor device, fabrication method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2766US2025331161A1Semiconductor device and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2865US2025386505A1Semiconductor device and method for manufacturing the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2964US2024196607A1Bi-directional conductive signal path for a 3d nand device and methods of fabricating the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 3063US11758723B2Three-dimensional memory device with source contacts connected by an adhesion layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·15 claims
- 3163US2025329645A1Semiconductor device, manufacturing method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3263US2025294723A1Semiconductor devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3362US2025386507A1Semiconductor structures and manufacturing methods thereof, memoary systems, and electronic devicesYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 3461US2025386504A1Semiconductor device, manufacturing method thereof, memory system and electronicsYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 3561US2025311321A1Semiconductor device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3660US2021151457A1Three-dimensional memory structure, three-dimensional memory device and electronic apparatusYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 3759USD1069612SBuilding controllerHONEYWELL INT INC·Filed 2023·Granted Apr 8, 2025·2 cites·1 claims
- 3859US11404442B2Protective structure and fabrication methods for the peripheral circuits of a three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 3959US11094713B2Three-dimensional memory device with source contacts connected by an adhesion layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 4058US2025287564A1Semiconductor devices and manufacturing methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 4157US2025040125A1Semiconductor structure and fabrication method thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 4256USD869849SElectronic makeup brushSHENZHEN ENIMEI TECH DEVELOPMENT CO LTD·Filed 2017·Granted Dec 17, 2019·11 cites·1 claims
- 4355US2024164100A1Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 4454US11127757B2Three-dimensional memory device with source structure and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 4554US11101286B2Three-dimensional memory device with source structure and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 4654USD902897SBuilding control moduleHONEYWELL INT INC·Filed 2019·Granted Nov 24, 2020·5 cites·1 claims
- 4754US2024206164A1Three-dimensional memory devices and system having the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 4853US12058864B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 6, 2024·0 cites·20 claims
- 4953US11456315B2Dual deck three-dimensional NAND memory with channel dips and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 27, 2022·0 cites·14 claims
- 5053US10756113B2Protective structure and fabrication methods for the peripheral circuits of a three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·16 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →