Three-dimensional memory structure, three-dimensional memory device and electronic apparatus

Abstract

A 3D memory structure, a 3D memory device and an electronic apparatus are disclosed and include a substrate having a recess, a 3D memory component with a bottom disposed in the recess of the substrate, and a peripheral circuit disposed on the substrate outside the recess.

What is claimed is: 
     
         1 . A 3D memory structure, comprising:
 a substrate having a recess;   a 3D memory component with a bottom disposed in the recess of the substrate; and   a peripheral circuit disposed on the substrate outside the recess.   
     
     
         2 . The 3D memory structure of  claim 1 , wherein a depth of the recess is greater than or equal to a thickness of the 3D memory component. 
     
     
         3 . The 3D memory structure of  claim 1 , wherein the 3D memory component comprises:
 an alternating conductor/dielectric stack, comprising a plurality of dielectric layers and a plurality of conductor layers, and each dielectric layer and each conductor layer are stacked alternately; and   a plurality of NAND strings through the alternating conductor/dielectric stack.   
     
     
         4 . The 3D memory structure of  claim 3 , further comprising a first insulation layer disposed on the alternating conductor/dielectric stack, wherein the NAND strings extend through the first insulation layer. 
     
     
         5 . The 3D memory structure of  claim 1 , further comprising a second insulation layer and a metal connection layer, wherein the second insulation layer is disposed on the peripheral circuit and the 3D memory component, the metal connection layer is disposed on the second insulation layer, and the peripheral circuit is electrically connected to the 3D memory component through the metal connection layer. 
     
     
         6 . The 3D memory structure of  claim 5 , further comprising an interconnection layer disposed between the second insulation layer and the metal connection layer. 
     
     
         7 . A 3D memory device, comprising the 3D memory structure of  claim 1 . 
     
     
         8 . An electronic apparatus, comprising the 3D memory device of  claim 7 .