Inventor · disambiguated record
Wen Zhu
Also filed as: ZHU WEN · ZHU WEN H · ZHU WEN HUI
6 granted patents·4 pending applications·92 citations·filing 2002–2006
83Inventor score
Top patents by PatentIndex Score
10 records- 0188US6699784B2Method for depositing a low k dielectric film (K>3.5) for hard mask applicationAPPLIED MATERIALS INC·Filed 2002·Granted Mar 2, 2004·42 cites·20 claims
- 0286US7435685B2Method of forming a low-K dual damascene interconnect structureAPPLIED MATERIALS INC·Filed 2006·Granted Oct 14, 2008·13 cites·18 claims
- 0380US7132369B2Method of forming a low-K dual damascene interconnect structureAPPLIED MATERIALS INC·Filed 2003·Granted Nov 7, 2006·27 cites·34 claims
- 0470US7588803B2Multi step ebeam process for modifying dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Sep 15, 2009·3 cites·12 claims
- 0552US7700486B2Oxide-like seasoning for dielectric low k filmsAPPLIED MATERIALS INC·Filed 2006·Granted Apr 20, 2010·3 cites·20 claims
- 0642US7115508B2Oxide-like seasoning for dielectric low k filmsAPPLIED MATERIALS INC·Filed 2004·Granted Oct 3, 2006·4 cites·14 claims
- 0741US2004101632A1Method for curing low dielectric constant film by electron beamAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 0839US2008150159A1Semiconductor Package with Perforated SubstrateABERIN IRWIN·Filed 2004·Application pending·0 cites
- 0937US2003211244A1Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectricAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1036US2003194495A1Crosslink cyclo-siloxane compound with linear bridging group to form ultra low k dielectricAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →