Inventor · disambiguated record
William Halliday
Also filed as: HALLIDAY WILLIAM · HALLIDAY WILLIAM MUIR
11 granted patents·6 pending applications·22 citations·filing 1999–2024
84Inventor score
Files withST MICROELECTRONICS INT NV5ST MICROELECTRONICS RES & DEV LTD4HALLIDAY WILLIAM3GERARD IND PTY LTD1ST MICROELECTRONICS GRENOBLE 21
Top patents by PatentIndex Score
17 records- 0174US10261175B2Ranging apparatusST MICROELECTRONICS RES & DEV LTD·Filed 2016·Granted Apr 16, 2019·3 cites·39 claims
- 0272US2025137841A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0371US10422877B2Substrate embedded time of flight sensor packagingST MICROELECTRONICS RES & DEV LTD·Filed 2016·Granted Sep 24, 2019·2 cites·24 claims
- 0468US11169266B2Substrate embedded time of flight sensor packagingST MICROELECTRONICS RES & DEV LTD·Filed 2019·Granted Nov 9, 2021·0 cites·16 claims
- 0565US2025138157A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0664US9195347B2Input device and associated methodSTARK LAURENCE·Filed 2011·Granted Nov 24, 2015·2 cites·21 claims
- 0761US9099368B2Electromagnetic shielding for camera modulesHALLIDAY WILLIAM·Filed 2010·Granted Aug 4, 2015·2 cites·23 claims
- 0860USD429225SElectronics housingGERARD IND PTY LTD·Filed 1999·Granted Aug 8, 2000·13 cites·1 claims
- 0960US2025138153A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1059US12403627B2Method for cutting substrate elementsST MICROELECTRONICS GRENOBLE 2·Filed 2023·Granted Sep 2, 2025·0 cites·22 claims
- 1158US2025344361A1Two part external shield for electromagnetic interference reductionST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1249US9413935B2Camera module, method of assembly and imaging deviceSTMICROELECTRONICS (RESEARCH & DEVELOPMENT) LTD·Filed 2013·Granted Aug 9, 2016·0 cites·25 claims
- 1348US2025125279A1Wire bond electromagnetic interference (emi) cage to block transmission and receipt of emi at an optical emissions componentST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 1447US10955289B2Electronic module including an ambient light sensor stacked over a proximity sensorST MICROELECTRONICS RES & DEV LTD·Filed 2019·Granted Mar 23, 2021·0 cites·24 claims
- 1541US8488056B2Modular camera system and a method of manufacturing the sameHALLIDAY WILLIAM·Filed 2010·Granted Jul 16, 2013·0 cites·26 claims
- 1639US8906177B2Method for controlling glue flowHALLIDAY WILLIAM·Filed 2011·Granted Dec 9, 2014·0 cites·18 claims
- 1737US2011008038A1Lens assembly and method of assembling lens elements in a lens mountingST MICROELECTRONICS RES & DEV·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →