Inventor · disambiguated record
William Y. Hata
Also filed as: HATA WILLIAM Y
14 granted patents·319 citations·filing 1993–2013
92Inventor score
Top patents by PatentIndex Score
14 records- 0191US5948697ACatalytic acceleration and electrical bias control of CMP processingLSI LOGIC CORP·Filed 1996·Granted Sep 7, 1999·110 cites·5 claims
- 0287US7316935B1Reticle for layout modification of wafer test structure areasALTERA CORP·Filed 2005·Granted Jan 8, 2008·10 cites·24 claims
- 0386US5880015AMethod of producing stepped wall interconnects and gatesSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Mar 9, 1999·102 cites·26 claims
- 0481US6956165B1Underfill for maximum flip chip package reliabilityALTERA CORP·Filed 2004·Granted Oct 18, 2005·31 cites·18 claims
- 0576US6967111B1Techniques for reticle layout to modify wafer test structure areaALTERA CORP·Filed 2003·Granted Nov 22, 2005·15 cites·13 claims
- 0671US6030425ACatalytic acceleration and electrical bias control of CMP processingLSI LOGIC CORP·Filed 1999·Granted Feb 29, 2000·33 cites·1 claims
- 0757US6982566B1Method and apparatus for operating a burn-in board to achieve lower equilibrium temperature and to minimize thermal runawayALTERA CORP·Filed 2004·Granted Jan 3, 2006·8 cites·27 claims
- 0856US9267985B2Bond and probe pad distributionHATA WILLIAM Y·Filed 2009·Granted Feb 23, 2016·1 cites·18 claims
- 0955US8003984B1Reticle for wafer test structure areasALTERA CORP·Filed 2007·Granted Aug 23, 2011·0 cites·19 claims
- 1049US9202772B2Heat pipe in overmolded flip chip packageALTERA CORP·Filed 2013·Granted Dec 1, 2015·0 cites·19 claims
- 1149US8148813B2Integrated circuit package architectureHATA WILLIAM Y·Filed 2009·Granted Apr 3, 2012·0 cites·17 claims
- 1248US8772085B2Integrated circuit package architectureHATA WILLIAM Y·Filed 2012·Granted Jul 8, 2014·0 cites·20 claims
- 1347US7212032B1Method and apparatus for monitoring yield of integrated circuitsALTERA CORP·Filed 2006·Granted May 1, 2007·1 cites·18 claims
- 1429US5366848AMethod of producing submicron contacts with unique etched slopesSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Nov 22, 1994·8 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →