Inventor · disambiguated record
William Jeffrey Schaefer
Also filed as: SCHAEFER JR WILLIAM J · SCHAEFER WILLIAM J · SCHAEFER WILLIAM JEFFREY
9 granted patents·782 citations·filing 1989–2004
92Inventor score
Top patents by PatentIndex Score
9 records- 0195US6084308AChip-on-chip integrated circuit package and method for making the sameNAT SEMICONDUCTOR CORP·Filed 1998·Granted Jul 4, 2000·244 cites·19 claims
- 0295US6075290ASurface mount die: wafer level chip-scale package and process for making the sameNAT SEMICONDUCTOR CORP·Filed 1998·Granted Jun 13, 2000·250 cites·18 claims
- 0392US6023094ASemiconductor wafer having a bottom surface protective coatingNAT SEMICONDUCTOR CORP·Filed 1998·Granted Feb 8, 2000·116 cites·6 claims
- 0490US6175162B1Semiconductor wafer having a bottom surface protective coatingNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jan 16, 2001·92 cites·7 claims
- 0581US6800815B1Materials and structure for a high reliability bga connection between LTCC and PB boardsNAT SEMICONDUCTOR CORP·Filed 2002·Granted Oct 5, 2004·30 cites·20 claims
- 0677USRE38789ESemiconductor wafer having a bottom surface protective coatingNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 6, 2005·19 cites·15 claims
- 0769US6770513B1Thermally enhanced flip chip packaging arrangementNAT SEMICONDUCTOR CORP·Filed 2000·Granted Aug 3, 2004·20 cites·2 claims
- 0859US7287323B1Materials and structure for a high reliability BGA connection between LTCC and PB boardsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Oct 30, 2007·8 cites·20 claims
- 0932US4972885APower module for special purpose woodworking toolsSHOPSMITH INC·Filed 1989·Granted Nov 27, 1990·3 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →