Inventor · disambiguated record
Willmar Subido
Also filed as: SUBIDO WILLMAR · SUBIDO WILLMAR E
22 granted patents·5 pending applications·614 citations·filing 1998–2025
96Inventor score
Files withTEXAS INSTRUMENTS INC12INVENSAS CORP9ADEIA SEMICONDUCTOR TECH LLC2INVENSAS LLC2ODEGARD CHARLES A1
Top patents by PatentIndex Score
27 records- 0198US10115678B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2017·Granted Oct 30, 2018·26 cites·20 claims
- 0298US9812402B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·30 cites·20 claims
- 0398US6800555B2Wire bonding process for copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 5, 2004·185 cites·9 claims
- 0497US11810867B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2022·Granted Nov 7, 2023·2 cites·28 claims
- 0597US9490222B1Wire bond wires for interference shieldingINVENSAS CORP·Filed 2015·Granted Nov 8, 2016·20 cites·20 claims
- 0696US10559537B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2018·Granted Feb 11, 2020·10 cites·18 claims
- 0795US10490528B2Embedded wire bond wiresINVENSAS CORP·Filed 2016·Granted Nov 26, 2019·17 cites·10 claims
- 0893US6268662B1Wire bonded flip-chip assembly of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 31, 2001·154 cites·17 claims
- 0990US11462483B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2019·Granted Oct 4, 2022·3 cites·24 claims
- 1086US12255153B2Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Mar 18, 2025·0 cites·25 claims
- 1186US6329722B1Bonding pads for integrated circuits having copper interconnect metallizationTEXAS INSTRUMENTS INC·Filed 1999·Granted Dec 11, 2001·94 cites·2 claims
- 1285US10008469B2Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2016·Granted Jun 26, 2018·4 cites·13 claims
- 1382US2025253264A1Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 1475US6521479B1Repackaging semiconductor IC devices for failure analysisTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 18, 2003·29 cites·37 claims
- 1570US6855578B2Vibration-assisted method for underfilling flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 15, 2005·13 cites·6 claims
- 1667US7476597B2Methods and systems for laser assisted wirebondingTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 13, 2009·3 cites·18 claims
- 1764US6182882B1Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframeTEXAS INSTRUMENTS INC·Filed 2000·Granted Feb 6, 2001·11 cites·10 claims
- 1851US2009029542A1Methods and systems for laser assisted wirebondingTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1950US2008003721A1Vibration-Assisted Method for Underfilling Flip-Chip Electronic DevicesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 2047US9502372B1Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 2146US6131792ABalancing of x and y axis bonding by 45 degree capillary positioningTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 17, 2000·2 cites·16 claims
- 2246US2005253281A1Vibration-assisted method for underfilling flip-chip electronic devicesODEGARD CHARLES A·Filed 2005·Application pending·0 cites
- 2345US6112973AAngled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframeTEXAS INSTRUMENTS INC·Filed 1998·Granted Sep 5, 2000·11 cites·10 claims
- 2441US9761554B2Ball bonding metal wire bond wires to metal padsINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·0 cites·3 claims
- 2541US9530749B2Coupling of side surface contacts to a circuit platformINVENSAS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·13 claims
- 2641US2005106851A1Wire bonding process for copper-metallized integrated circuitsFiled 2004·Application pending·0 cites
- 2729US6089443ABalancing of x and y axis bonding by 45 degree capillary positioningTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 18, 2000·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →