Inventor · disambiguated record
William Weigler
Also filed as: WEIGLER WILLIAM · WEIGLER WILLIAM C
4 granted patents·81 citations·filing 1990–2004
72Inventor score
Top patents by PatentIndex Score
4 records- 0174US5220490ASubstrate interconnect allowing personalization using spot surface linksMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jun 15, 1993·61 cites·28 claims
- 0246US5224022AReroute strategy for high density substratesMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jun 29, 1993·20 cites·13 claims
- 0338US7300820B2Adhesive assembly for a circuit boardTEMIC AUTOMOTIVE NA INC·Filed 2004·Granted Nov 27, 2007·0 cites·12 claims
- 0429US7353983B2Vertical removal of excess solder from a circuit substrateTEMIC AUTOMOTIVE NA INC·Filed 2003·Granted Apr 8, 2008·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →