Inventor · disambiguated record
Woonjae Beak
Also filed as: BEAK WOONJAE
6 granted patents·1 pending application·20 citations·filing 2014–2023
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0190US10700011B2Semiconductor device and method of forming an integrated SIP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 30, 2020·7 cites·22 claims
- 0288US11769730B2Semiconductor device and method of providing high density component spacingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 26, 2023·2 cites·25 claims
- 0381US9693455B1Integrated circuit packaging system with plated copper posts and method of manufacture thereofPARK SEONG WON·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 0469US2023402383A1Semiconductor Device and Method of Providing High Density Component SpacingSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0567US10804119B2Method of forming SIP module over film layerSTATS CHIPPAC PTE LTD·Filed 2017·Granted Oct 13, 2020·1 cites·18 claims
- 0665US11367690B2Semiconductor device and method of forming an integrated SiP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 21, 2022·0 cites·23 claims
- 0764US11309193B2Semiconductor device and method of forming SIP module over film layerSTATS CHIPPAC PTE LTD·Filed 2020·Granted Apr 19, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →