Inventor · disambiguated record
Wolfgang Diewald
Also filed as: DIEWALD WOLFGANG
4 granted patents·1 pending application·56 citations·filing 2000–2023
75Inventor score
Top patents by PatentIndex Score
5 records- 0181US6257955B1Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafersINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jul 10, 2001·34 cites·24 claims
- 0267US2023330769A1Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0363US11712749B2Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·26 claims
- 0462US6277761B1Method for fabricating stacked viasSIEMENS AG·Filed 2000·Granted Aug 21, 2001·14 cites·7 claims
- 0555US6764954B2Application of alignment marks to waferINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jul 20, 2004·8 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →