Inventor · disambiguated record
Wolfram Hable
Also filed as: HABLE WOLFRAM
18 granted patents·3 pending applications·72 citations·filing 2002–2024
92Inventor score
Top patents by PatentIndex Score
21 records- 0193US10074590B1Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·16 cites·30 claims
- 0293US9275926B2Power module with cooling structure on bonding substrate for cooling an attached semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·22 cites·15 claims
- 0392US10128165B2Package with vertically spaced partially encapsulated contact structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·11 cites·25 claims
- 0482US9589922B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·5 cites·5 claims
- 0579US12438063B2Electronic module including a semiconductor package disposed on an interposer layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0677US9397018B2Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 19, 2016·4 cites·17 claims
- 0771US7592696B2Power module having at least two substratesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 22, 2009·4 cites·22 claims
- 0868US11862533B2Fluid-cooled package having shielding layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 0967US11574889B2Power module comprising two substrates and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 7, 2023·2 cites·12 claims
- 1066US11955407B2Electronic module including a semiconductor package connected to a fluid heatsinkINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 1166US10461017B2Package with partially encapsulated cooling channel for cooling an encapsulated chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·1 cites·15 claims
- 1266US9585241B2Substrate, chip arrangement, and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 28, 2017·2 cites·17 claims
- 1365US10037972B2Electronic module comprising fluid cooling channel and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 31, 2018·1 cites·13 claims
- 1453US10283432B2Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 7, 2019·0 cites·20 claims
- 1551US7176057B2Power module comprising at least two substrates and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Feb 13, 2007·4 cites·10 claims
- 1650US11244886B2Package cooled with cooling fluid and comprising shielding layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 8, 2022·0 cites·22 claims
- 1747US2017154835A1Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1845US10615097B2Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheetINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 7, 2020·0 cites·23 claims
- 1942US10079195B2Semiconductor chip package comprising laterally extending connectorsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Sep 18, 2018·0 cites·20 claims
- 2038US2012075812A1Multi-chip packageHABLE WOLFRAM·Filed 2011·Application pending·0 cites
- 2135US2003112605A1Power module and process for producing power modulesFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wolfram Hable files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →