Inventor · disambiguated record
Woon Suk Jung
Also filed as: JUNG WOON SUK
5 granted patents·1 pending application·2 citations·filing 2013–2023
62Inventor score
Files withHOJIN PLATECH CO LTD6
Top patents by PatentIndex Score
6 records- 0177US9150977B2Copper plating solutionHOJIN PLATECH CO LTD·Filed 2014·Granted Oct 6, 2015·2 cites·1 claims
- 0274US11879181B2Electroplating solution of tin or tin alloy with improved thickness variation of wafer bumpsHOJIN PLATECH CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·5 claims
- 0372US12071703B2Electroplating solution for indium-bismuth alloy for low-temperature solder with improved bismuth substitution prevention performanceHOJIN PLATECH CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·5 claims
- 0454US9194053B2Substrate carrier device for double-sided electroplating of solar cellHOJIN PLATECH CO LTD·Filed 2013·Granted Nov 24, 2015·0 cites·13 claims
- 0553US2022170161A1Substrate plating apparatus including hybrid paddle that simultaneously circulates and stirs plating solution and removes air bubblesHOJIN PLATECH CO LTD·Filed 2021·Application pending·0 cites
- 0639US9525096B2Plating equipment for solar cell wafer using electroplating and light-induced plating jointly and method of the sameHOJIN PLATECH CO LTD·Filed 2014·Granted Dec 20, 2016·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →